Development of fixed abrasive chemical mechanical polishing process for glass disk substrates
- 617 Downloads
Glass disk substrates are used in a wide range of portable devices because of their relatively high resistance to heat and shocks compared to aluminum substrates. Chemical mechanical polishing (CMP) with fixed abrasive pad is an alternative glass disk substrates finishing method to loose abrasive lapping and polishing with traditional pad. In this paper, we developed a chemical mechanical polishing process for 2.5-inch glass disk substrates using a fixed abrasive pad. A serial of CMP experiments were carried out under different polishing variables and conditioning modes (ex situ and in situ conditioning). The polishing performances were evaluated and analyzed in terms of surface roughness, surface topography, and material removal rate. The polishing characteristics were also discussed to reveal material removal mechanism and surface generation involved in fixed abrasive CMP for glass disk substrates.
KeywordsChemical mechanical polishing Fixed abrasive polishing Material removal rate Surface roughness Glass disk substrate Hard disk driver
Unable to display preview. Download preview PDF.
- 5.Tian YB, Ang YJ, Zhong ZW, Hu X, Tan R (2013) Chemical mechanical polishing of glass disk substrates: preliminary experimental investigation, Mater Manuf Process 28(4). doi: 10.1080/10426914.2011.654161
- 7.Lineback R (2011) Impressive Growth Continues for Tablet Computer, Research Bulletin, IC Insights, 28 November, 2011Google Scholar
- 10.Kulawski M, Microelectronics VTT, Espoo LH, Henttinen K, Suni T, Weimar F, Makinen J (2005) Polishing of bulk micro-machined substrates by fixed abrasive pads for smoothing and planarization of MEMS structures, Advanced Semiconductor Manufacturing Conference and Workshop, 2005 IEEE/SEMI, 11–12 April 2005. Munich, German, pp 5–10Google Scholar
- 11.Douglas PG, Paul MN, Fixed abrasive article for use in modifying a semiconductor wafer, Patent No.: US 7,329,171 B2, Feb 12, 2008Google Scholar
- 12.Kojima H, Ito M, Takemiya S, Method of polishing glass substrates, Patent No.: US 2010/0086864 A1, Apr. 8, 2010Google Scholar
- 20.Zhou L, Kawaii S, Kimura S, Shimuzu J, Eda H (2003) Development of chemo-mechanical grinding (CMG) process, International Conference on Leading Edge Manufacturing in 21st Century, Nov.3–6, 2003, Niigata, Japan, pp315–320Google Scholar