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Circuits, Systems, and Signal Processing

, Volume 37, Issue 9, pp 3888–3902 | Cite as

Semiempirical Model for IC Interconnects Considering the Coupling Between the Signal Trace and the Ground Plane

  • Mónico Linares-Aranda
  • Oscar González-Díaz
  • Diego M. Cortés-Hernández
  • Reydezel Torres-Torres
Article
  • 99 Downloads

Abstract

A semiempirical, piecewise-defined, and physical model for integrated circuit interconnects is presented. The proposed model accurately represents the corresponding frequency-dependent resistance, and self- and mutual inductances while also accounting for the eddy currents induced in the ground metal layer. For the model implementation, different frequency regions where the resistance, and the self- and mutual inductances exhibit different trends due to the variation in the effective area where the current is flowing are identified, as well as the corresponding transitional frequencies. Experimental results performed to on-chip test structures fabricated on an RF-CMOS technology are used to validate the proposed model up to 40 GHz.

Keywords

Series resistance Mutual inductance On-chip interconnects Ground plane Integrated circuits VLSI 

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Copyright information

© Springer Science+Business Media, LLC, part of Springer Nature 2018

Authors and Affiliations

  1. 1.Department of ElectronicsInstituto Nacional de Astrofísica, Óptica y Electrónica (INAOE)Santa. María TonantzintlaMéxico
  2. 2.Board Development, Intel Tecnología de MéxicoZapopanMéxico

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