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The Role of Thin Film Materials on the Technology of Integrated Circuit Fabrication

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Additional information

Federico O. Sequeda received his Ph.D. in materials science at the University of Illinois. He is currently Manager at the Materials Technology Department, Central Scientific Services of the IBM Research Lab in San Jose, California.

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Sequeda, F. The Role of Thin Film Materials on the Technology of Integrated Circuit Fabrication. JOM 37, 54–60 (1985). https://doi.org/10.1007/BF03258746

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Keywords

  • Polysilicon
  • Refractory Metal
  • Solder Bump
  • Alloy Film
  • Very Large Scale Integration