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IC Packaging: The Materials Science Challenge

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Correspondence to T. D. Schlabach.

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Schlabach, T.D. IC Packaging: The Materials Science Challenge. JOM 40, 31 (1988). https://doi.org/10.1007/BF03258170

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Keywords

  • Solder Joint
  • Thermal Fatigue
  • Bell Laboratory
  • Circle Reader Service Card Number
  • Life Prediction Method