, Volume 48, Issue 5, pp 49–53 | Cite as

The mechanical behavior of interconnect materials for electronic packaging

  • D. R. Frear
Electronic Interconnect Research Summary


A variety of new materials are needed for solder interconnects in electronic packages for high- and low-temperature applications. This article compares the mechanical behavior of low-temperature materials (Sn-40In-20Pb, Sn-58Bi, and a silver-loaded conductive adhesive) and high-melting-temperature solders (Sn-3.5Ag, Sn-3.4Ag-4.8Bi, and Sn-4.7 Ag-1.7Cu) to near-eutectic Sn-40Pb solder. The results indicate that there are promising materials alternatives to the traditional Sn-Pb solders in electronic interconnect applications.


Fracture Toughness Solder Joint Solder Alloy Intermetallic Layer Conductive Adhesive 
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Copyright information

© TMS 1996

Authors and Affiliations

  • D. R. Frear
    • 1
  1. 1.Sandia National LaboratoriesUSA

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