Advertisement

JOM

, Volume 48, Issue 5, pp 49–53 | Cite as

The mechanical behavior of interconnect materials for electronic packaging

  • D. R. Frear
Electronic Interconnect Research Summary

Abstract

A variety of new materials are needed for solder interconnects in electronic packages for high- and low-temperature applications. This article compares the mechanical behavior of low-temperature materials (Sn-40In-20Pb, Sn-58Bi, and a silver-loaded conductive adhesive) and high-melting-temperature solders (Sn-3.5Ag, Sn-3.4Ag-4.8Bi, and Sn-4.7 Ag-1.7Cu) to near-eutectic Sn-40Pb solder. The results indicate that there are promising materials alternatives to the traditional Sn-Pb solders in electronic interconnect applications.

Keywords

Fracture Toughness Solder Joint Solder Alloy Intermetallic Layer Conductive Adhesive 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

References

  1. 1.
    U.S. Congress, Senate, “Lead Exposure Reduction Act of 1994,” DEC. 401. Finding and Policy, paragraph (a), l03rd Congress, 5.729, Congressional Record, Legi-Slate, Washington, D.C. (May 25, 1994), p. S–6332.Google Scholar
  2. 2.
    D.R. Frear, F.M. Hosking, and P.T. Vianco, “Mechanical Behavior of Solder Joint Interfacial Intermetallics,” Materials Developments in Microelectronic Packaging: Performance and Reliability (Materials Park, OH: ASM, 1991), pp. 229–240.Google Scholar
  3. 3.
    D.R. Frear and P.T. Vianco, “Intermetallic Growth and Mechanical Behavior of Low Melting Temperature Solder Alloys,” Metall. Trans. A, 25A (1994), p. 1509.Google Scholar
  4. 4.
    Darrel Frear, Thermomeclumical Fatigue of Solder Joints: A New Comprehensive Test Method (New York: IEEE, 1989), p. 293.Google Scholar
  5. 5.
    D.R. Frear, “Microstructural Evolution During the Thermomechanical Fatigue of Solder Joints,” The Metal Science of Joining, ed. Cieslak et al. (Warrendale, PA: TMS, 1992), pp. 191–200.Google Scholar
  6. 6.
    D.R. Frear, W.B. Jones, and K.R. Kinsman, eds., Solder Mechanics: A State of the Art Assessment (Warrendale, PA: TMS, 1991).Google Scholar
  7. 7.
    S.M. Lee and D.S. Stone, “Grain Boundary Sliding in Surface Mount Solders During Thermal Cycling,” Proc 40th IEEE ECTC (New York: IEEE, 1990), pp. 491–495.Google Scholar
  8. 8.
    D.S. Stone and S.M. Lee, “Grain Boundaries and the Thermal Fatigue of Surface Mount Solder Joints,” 1990 SMART Conf. (1990).Google Scholar
  9. 9.
    D.R. Frear and W.B. Jones, “Cyclic Deformation of 60Sn-40Pb Solder Joints During Thermomechanical Fatigue,” Proc. of NEPCON ′90 (Des Plaines, IL: Cahners Exposition Group, 1990), pp. 1340–1352.Google Scholar
  10. 10.
    D.R. Frear, “Microstructural Evolution During Thermomechanical Fatigue of 62Sn-36Pb-2Ag and 60Sn-40Pb Solder Joints,” Proc. 40th ECTC Conf. (New York: IEEE, 1990), pp. 518–524.Google Scholar
  11. 11.
    D. Tribula et al., “Observations on the Mechanisms of Fatigue in Eutectic Pb-Sn Solder Joints,” Proc. ASME Winter Meeting (New York: ASME, 1988).Google Scholar
  12. 12.
    D. Tribula et al., “Microstructural Observations of Thermomechanically Deformed Solder Joints,” Welding Res. Supp., (Oct. 1989), p. 404s.Google Scholar
  13. 13.
    D. Frear, D. Grivas, and J.W. Morris, Jr., “Thermal Fatigue in Solder Joints,” J. Metals, 40 (1988), p. 18.Google Scholar
  14. 14.
    D. Frear, D. Grivas, and J.W. Morris, Jr., “Microstructural Study of the Thermal Fatigue Failures in 60Sn-40Pb Solder Joints,” J. Electr. Materials, 17 (1988), p. 171.Google Scholar

Copyright information

© TMS 1996

Authors and Affiliations

  • D. R. Frear
    • 1
  1. 1.Sandia National LaboratoriesUSA

Personalised recommendations