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JOM

, Volume 42, Issue 9, pp 55–55 | Cite as

Investigating the integrity and reliability of electronic packaging and interconnection materials

  • Bela Sandor
  • Tom Kilinski
Forum Lab Report
  • 27 Downloads

Keywords

Crack Initiation Solder Joint Print Circuit Board Electronic Packaging Shear Joint 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Copyright information

© TMS 1990

Authors and Affiliations

  • Bela Sandor
    • 1
  • Tom Kilinski
    • 1
  1. 1.University of Wisconsin-MadisonUSA

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