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Alloy gold deposits for electronic applications

An evaluation of the gold-copper-cadmium sulphite system

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Abstract

Although processes for the electrodeposition of alloy golds have been available for some years they have so far found few applications in the electronics industry. This article, based in part on a paper presented to the Ninth World Congress on Metal Finishing held in Amsterdam in October, first reviews the literature on the numerous alloy gold systems available and then gives an assessment of the particular process considered by the author to be the most satisfactory.

References

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    G. Foulke and R. Duva, A.E.S. Fourth Plating in the Electronics Industry Symposium, 1973

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    F. I. Nobel, D. W. Thomson and J. M. Leibel, A.E.S. Fourth Plating in the Electronics Industry Symposium, 1973;Plating, 1973,60, (7), 720

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    D. R. Mason, A. Blair and P. Wilkinson, Proceedings, Internepcon 1974, Connector Symposium, pp 48–61;Trans. Inst. Metal Finish., 1974,52, 143. See also D. R. Mason,Gold Bull., 1974,7, (4), 104

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    J. Souter, Proceedings, Internepcon 1974, Connector Symposium, pp 62–76

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    W. Flühmann, W. Saxer, F. Aubert and H. E. Hintermann,Galvanotechnik, 1974,65, (8), 652

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    H. Shoushanian and A. M. Weisberg, A.E.S. Fifth Plating in the Electronics Industry Symposium, 1975

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    K. G. Ashurst and R. W. Neale,Trans. Inst. Metal Finish., 1967,45, 75

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Cite this article

Fairweather, W.A. Alloy gold deposits for electronic applications. Gold Bull 10, 15–20 (1977). https://doi.org/10.1007/BF03216520

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Keywords

  • Contact Resistance
  • Gold Deposit
  • Sulphite
  • Alloy Gold
  • Alloy Deposit