Advertisement

Gold Bulletin

, Volume 19, Issue 3, pp 75–81 | Cite as

Understanding gold plating

  • Peter Wilkinson
Open Access
Article

Abstract

For effective operation, gold plating baths must require the minimum of attention in respect of replenishment and replacement, and must produce as little sub-standard or reject work as possible. To achieve this, an understanding of the processes involved and the factors affecting them is advantageous. This article attempts to provide such an understanding in a simple manner. Special attention is given to the plating of gold from acid baths containing monovalent gold complexes.

Keywords

Cyanide Gold Deposit Sulphite Gold Complex Cyanide Complex 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

References

  1. 1.
    J. Souter,Trans. I.E.E.E. Part 1, Hybrid Pack, March 1974, 18Google Scholar
  2. 2.
    G.B. Munier,Plating, 1969,56, 1151–1157Google Scholar
  3. 3.
    P. Wilkinson,Trans. Inst. Met. Finish., 1981,59, 57–60Google Scholar
  4. 4.
    ‘Stability Constants’,Chem. Soc., Special Publication No. 17, 1964, 111 and 109Google Scholar
  5. 5.
    A. Knödler,Metalloberfläche, 1979,33, 7Google Scholar
  6. 6.
    Y. Okinaka,West. Elect. Eng., 1978,22, (2), 72–81Google Scholar
  7. 7.
    E. Freedman and J.N. Shea,U.S. Pat. 3598706, 1971Google Scholar
  8. 8.
    A. Fletcher and W.L. Moriarty,U.S. Pat. 4168214, 1979Google Scholar
  9. 9.
    Oxy Metal Industries,German Pat. DE-OS 2658003, 1976Google Scholar
  10. 10.
    W. Zilske,German Pat. DE-OS3012999Al, 1981Google Scholar
  11. 11.
    J.M. Deuber and H.J. Luebke, ‘72nd Ann. Tech. Conf. Proc., Am. Electroplaters’ Soc.,’ 1985, G3Google Scholar
  12. 12.
    Arakawa Kako KK,Jpn. Pat. Appl. 57174487, 1981Google Scholar
  13. 13.
    Arakawa Kako KK,Jpn. Pat. Appl. 57203787, 1981Google Scholar
  14. 14.
    Arakawa Kako KK,Jpn. Pat. Appl. 57203788, 1981Google Scholar
  15. 15.
    J.P. Derivaz, A. Resin and S. Losi,Surf. Technol, 1977,5, 369–377CrossRefGoogle Scholar
  16. 16.
    S.A. Losi, F.L. Zuntini and R.A. Myer,Electrodeposition Surf. Treatment, 1972/1973,1, 3–19;Surfaces (Paris), 1973,12, 67–75CrossRefGoogle Scholar
  17. 17.
    S.T. Rao and R. Weil,Trans. Inst. Met. Finish., 1979,57, 97–101Google Scholar
  18. 18.
    D.R. Mason and A. Blair,Trans. Inst. Met. Finish., 1972,50, 138–140Google Scholar
  19. 19.
    L. Holt and J. Stanyer,Trans Inst. Met. Finish., 1972,50, 24–27Google Scholar
  20. 20.
    E.T. Eisenmann,J. Electrochem. Soc., 1977,124, 1957–1958CrossRefGoogle Scholar
  21. 21.
    J. Souteret al., ‘Connectors ’85, Leicester’, 1985, 43Google Scholar
  22. 22.
    P. Wilkinson and C. Martin, ‘ICT Conf. Brunel University’, 1984Google Scholar
  23. 23.
    H. Leidheiseret al., J. Electrochem. Soc., 1979,126 391–394CrossRefGoogle Scholar
  24. 24.
    R.L. Cohenet al., J. Electrochem Soc., 1979,126, 1608–1618CrossRefGoogle Scholar
  25. 25.
    Ya.M. Popeneka,Fiz. Met. Metallored., 1965,20, (5), 753Google Scholar

Copyright information

© World Gold Council 1986

Authors and Affiliations

  • Peter Wilkinson
    • 1
  1. 1.Engelhard LimitedCinderfordUK

Personalised recommendations