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Optimisation des performances de modules multipuces Modélisation par réseaux de neurones

Optimization of the multichip module performance modeling using neural networks

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Largement utilisés dans la conception de modules multipuces micro-ondes, les modèles de composants passifs font l’objet de recherches intensives. Cet article introduit le concept de génération automatisée de modèles de composants passifs et d’interconnexions par réseaux de neurones. Précis et rapides, ces modèles intègrent efficacement les effets électromagnétiques présents aux hyperfréquences. En optimisant les performances d’un circuit, notre approche peut déterminer automatiquement non seulement la structure géométrique finale des différents composants passifs et de leurs interconnexions respectives mais également, pour la première fois, leur localisation optimale dans le circuit. Des applications utilisant des modèles de composants passifs implémentés dans des simulateurs de circuits sont présentées.


Widely used in microwave multichip module design, passive device models are subject to intensive researches. This paper introduces the concept of automate generation of neural models for passives and interconnects. Accurate and fast, these models efficiently integrate electromagnetic effects present at microwave frequencies. By optimizing the circuit performance, the proposed approach can automatically predict not only the final geometrical structure of the different passive components and their respective interconnects but also, for the fist time, their optimum location in the circuit. Applications using passive models implemented in circuit simulators are presented.

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Correspondence to Mustapha C. E. Yagoub.

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Yagoub, M.C.E. Optimisation des performances de modules multipuces Modélisation par réseaux de neurones. Ann. Télécommun. 59, 1092–1117 (2004).

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Mots clés

  • Circuit intégré hyperfréquence
  • Circuit intégré hybride
  • Composant passif
  • Interconnexion
  • Réseau neuronal
  • Optimisation
  • Automatisation
  • Simulateur
  • Boîtier métallique

Key words

  • Microwave integrated circuit
  • Hybrid integrated circuit
  • Passive component
  • Interconnection
  • Neural network
  • Optimization
  • Automation
  • Simulator
  • Multichip module