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Flow stress, subgrain size, and subgrain stability at elevated temperature

  • Symposium on Mechanical-Thermal Processing and Dislocation Substructure Strengthening
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Abstract

Well defined subgrain boundaries dominate the microstructural changes occurring during plastic flow of polycrystalline metals at elevated temperature. The quantitative influence of subgrain size on elevated-temperature plastic flow is considered. Based on the results of tests under constant-stress and constant-structure conditions, an equation is developed which predicts the creep rate as a function of subgrain size, stress, diffusion coefficient, and elastic modulus. In general, the subgrain size is a unique function of the current modulus-compensated flow stress, but if fine subgrains can be introduced and stabilized, large increases in creep strength may result. The applicability of the phenomenological relation developed to the behavior of dispersion-strengthened materials (where the second-phase particles may predetermine the effective subgrain size) is discussed. When subgrain effects are included, it is shown that the creep rate is less dependent on stacking fault energy than has been previously thought.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, Stanford University, 94305, Stanford, CA

    Oleg D. Sherby (Professor), Rodney H. Klundt (Research Assistant) & Alan K. Miller (Research Associate)

Authors
  1. Oleg D. Sherby
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  2. Rodney H. Klundt
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  3. Alan K. Miller
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Additional information

This paper is based on a presentation made at a symposium on “Mechanical-Thermal Processing and Dislocation Substructure Strengthening,” held at the Annual Meeting in Las Vegas, Nevada, on February 23, 1976, under the sponsorship of the TMS/IMD Heat Treating Committee.

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Sherby, O.D., Klundt, R.H. & Miller, A.K. Flow stress, subgrain size, and subgrain stability at elevated temperature. Metall Trans A 8, 843–850 (1977). https://doi.org/10.1007/BF02661565

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