Local time—Temperature-dependent deformation of a woven composite
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Moiré interferometry is utilized to investigate the time-temperature-dependent deformation of a woven composite substrate used in multilayer circuit board applications. Creep tests are performed at temperatures ranging from 27 to 70°C, and the resulting longitudinal and transverse displacement fields are measured via moiré interferometry. Measured displacement fields reveal the influence of fabric architecture on woven composite response. The deformation fields in the plane of the composite for loading along both warp and fill directions consist of a periodic arrangement of high-strain and low-strain regions in accordance to the interlacing bundle architecture. The deformation fields over the cross-section of the composite indicate that neighboring unit cells are subjected to equal and opposite bending moment even when the composite is loaded in uniaxial tension.
Key wordsWoven composite time-temperature-dependent response Moiré interferometry creep and stress relaxation multilayer circuit boards textile composites
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- 1.Sottos, N.R., Ockers, J.M., andSwindeman, M., “Thermoelastic Properties of Plain Weave Composites for Multilayer Circuit Board Applications,” Journal of Electronic Packaging,121,37–43 (1999).Google Scholar
- 3.Yuan, J. andFalanga, L.A., “The In-Plane Thermal Expansion of Glass Fabric Reinforced Epoxy Laminates,” Journal of Reinforced Plastics and Composites,12,489–496 (1993).Google Scholar
- 4.Wang, T.M., Daniel, I.M., andGotro, J.T., “Thermoviscoelastic Analysis of Residual Stresses and Warpage in Composite Laminates,” Journal of Composite Materials,26,883–899 (1992).Google Scholar
- 6.Kuhn, J.L. andCharalambides, P.G., “Elastic Response of Porous Matrix Plain, Weave Fabric Composites. I. Modeling,” Journal of Composite Materials,32,1426–1471 (1998).Google Scholar
- 7.Kuhn, J.L., andCharalambides, P.G., “Elastic Response of Porous Matrix Plain Weave Fabric Composites. II. Results,” Journal of Composite Materials,32,1472–1507 (1998).Google Scholar
- 9.MirZadeh, F. andReifsnider, K.L., “Micro-Deformations in C3000/PMR15 Woven Composite,” Journal of Composite Materials,26,185–205 (1992).Google Scholar
- 10.Post, D., Han, B., andIfju, P.G., High Senstivity Moire, Springer-Verlag, New York (1994).Google Scholar
- 12.Stout, E.A., “Characterization of Electronic Packaging Using Moire Interferometry,” Masters Thesis, Theoretical and Applied Mechanics Department, University of Illinois at Urbana-Champaign (1997).Google Scholar
- 13.Shrotriya, P., “Dimensional Stability of Multilayer Circuit Boards,” PhD Dissertation, Department of Theoretical and Applied Mechanics, University of Illinois at Urbana-Champaign (2000).Google Scholar