Journal of Materials Science

, Volume 27, Issue 22, pp 6123–6126 | Cite as

Effects of static magnetic field on undercooling of a copper melt

  • M. Hasegawa
  • S. Asai
Papers

Abstract

The effects of static magnetic field (5000 Oe) were investigated on undercooling of a copper melt in glass slag. The procedure of melting and solidifying was repeated 13 times in each sample. The thermal analysis curves for ten samples (five samples in the presence of magnetic field and five samples in the absence of magnetic field) were measured during every melting-solidifying cycle and the degree of undercooling was obtained in every cycle. The undercoolings of all samples increased in a few numbers of early cycles and after about six cycles they were almost saturated and independent of cycle number. Irregular and unexpectedly large decreases of undercooling sometimes appeared. Two remarkable effects of magnetic field on undercooling were found. One is that the maximum undercooling in the presence of a magnetic field is apparently higher than that in the absence of a magnetic field for every sample. The second is that the application of magnetic field tends to suppress the irregular and unexpectedly large decreases of undercooling. These results are discussed in respect of the thermodynamic effect (the magnetic free energy change on solidification) and the magnetohydrodynamic effect (the suppression of thermal convection).

Keywords

Copper Magnetic Field Convection Free Energy Thermal Analysis 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. 1.
    H. Jones,J. Mater. Sci. 19 (1984) 1043.Google Scholar
  2. 2.
    A. J. McLeod andL. M. Hogan,Met. Trans. 9A (1978) 987.Google Scholar
  3. 3.
    T. Z. Kattamis andM. C. Flemings,Trans. Met. Soc. AIME 236 (1966) 1523.Google Scholar
  4. 4.
    K. F. Kobayashi andP. H. Shingu,J. Mater. Sci. 23 (1988) 2157.Google Scholar
  5. 5.
    M. C. Flemings andY. Shiohara,Mater. Sci. Engng 65 (1984) 157.Google Scholar
  6. 6.
    H. P. Utech andM. C. Flemings,J. Appl. Phys. 37 (1966) 2021.Google Scholar
  7. 7.
    H. A. Chedzey andD. T. J. Hurle,Nature 210 (1966) 933.Google Scholar
  8. 8.
    A. F. Witt, C. J. Herman andH. C. Gatos,J. Mater. Sci. 5 (1970) 822.Google Scholar
  9. 9.
    K. M. Kim,J. Electrochem. Soc. 129 (1982) 427.Google Scholar
  10. 10.
    Y. Kishida, K. Takeda, I. Miyoshino andE. Takeuchi,ISIJ Int. 30 (1990) 34.Google Scholar
  11. 11.
    R. W. Series,J. Cryst. Growth 97 (1989) 92.Google Scholar
  12. 12.
    M. Schieber,ibid. 1 (1967) 131.Google Scholar
  13. 13.
    W. V. Youdelis, D. R. Colton andJ. Cahoon,Can. J. Phys. 42 (1964) 2238.Google Scholar
  14. 14.
    Y. Aoki, S. Hayashi andH. Komatsu,J. Crystal Growth 108 (1991) 121.Google Scholar
  15. 15.
    T. Takahashi, M. Kudoh, K. Ohsasa andJ. Tanaka,Trans. ISIJ 27 (1987) 936.Google Scholar

Copyright information

© Chapman & Hall 1992

Authors and Affiliations

  • M. Hasegawa
    • 1
  • S. Asai
    • 1
  1. 1.Department of Materials Science and EngineeringNagoya UniversityNagoyaJapan

Personalised recommendations