Fracture mechanism of brass/Sn-Pb-Sb solder joints and the effect of production variables on the joint strength
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The effect of various processing parameters on the strength of brass/Sn-Pb-Sb solder joints containing 0–10% Sb have been determined and the fracture mechanism examined by microscopical techniques. Soldering times up to 1 h at 300° C caused the greatest decrease in the strength of joints with solder containing 3% Sb. After 1 h joints with solders containing 0, 3, 5 and 10% Sb all had a similar strength. Cooling rates after soldering (from water quenching to furnace cooling) and joint gap thickness (from 0.05 to 0.20mm) had a negligible effect on joint strength. Fracture occurs through a region of high porosity in the solder at the brass/ solder interface. The presence of Sb and/or cuboids of SnSb in the solder increases the number and size of the pores and the cuboids tend to physically locate the pores at the interface.
KeywordsPolymer Porosity Furnace Fracture Mechanism Solder Joint
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