Thin plate bending problem of dissimilar strips with two bond lines
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Summary
A solution to the thin plate bending problem of partially bonded dissimilar strips with two bond lines is presented. The two strips are symmetrically bonded with respect to the interface which is on theX-axis. The complex stress functions approach together with the rational mapping function technique are used in the analysis. A concentrated bending moment applied at each strip is considered. Distributions of bending and torsional moments, as well as the stress intensity of debonding (SID) at the debonding tips are obtained, and the debonding extension is investigated.
Key words
thin plate bending dissimilar strips complex stress functions interface debonding stress intensity of debondingPreview
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References
- 1.Hasebe, N.;Salama, M.: Thin plate bending problem of partially bonded bi-material strips. Arch. Appl. Mech. 64 (1994) 423–434Google Scholar
- 2.Hasebe, N.; Salama, M.: Thermal stress analysis of thin plate bending of partially bonded dissimilar strips. Proc. Fourth Int. Conf. Residual Stresses, Society for Experimental Mechanics, Baltimore, Maryland, 1994Google Scholar
- 3.Muskhelishvili, N. I.: Some basic problems of the mathematical theory of elasticity. Groningen: Noordhoff 1963Google Scholar
- 4.Hasebe, N.; Kaato, S.; Nakamura, T.: Bimaterial problem of strip with debondings under tension and bending. ASTM STP1220 25 (1994)Google Scholar
- 5.Savin, G. N.: Stress concentration around holes, Oxford: Pergamon Press 1961Google Scholar
- 6.Hasebe, N.;Tsutsui, S.;Nakamura, T.: A mixed boundary value problem for debonding of a semi-elliptic rigid inclusion on the rim of a half plane. Arch. Appl. Mech. 62 (1992) 306–315Google Scholar
- 7.Hasebe, N.;Tsutsui, S.;Nakamura, T.: Debondings at a semi-elliptic rigid inclusion on the rim of a half plane. Trans. ASME/J. Appl. Mech. 55 (1988) 574–579Google Scholar
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