Journal of Materials Science

, Volume 17, Issue 9, pp 2560–2566 | Cite as

Grain size effect of electro-plated tin coatings on whisker growth

  • Tomoyuki Kakeshita
  • Ken'ichi Shimizu
  • Ryusuke Kawanaka
  • Tomoharu Hasegawa


Tin and tin-lead coatings electro-plated in various solutions have been observed by means of high voltage electron microscopy, and the grain size effect of the coatings on whisker growth has been examined. As a result, it was found that the tin and tin-lead coatings from which whiskers hardly grew consisted of well-polygonized grains which were a few micrometre in size, and that the tin coatings from which whiskers easily grew consisted of irregular-shaped grains which were a few tenths of a micrometre in size. The irregularshaped grains contained dislocation rings which might be formed by clustering of vacancies or interstitial atoms upon electro-plating.


Polymer Grain Size Microscopy Electron Microscopy High Voltage 
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Copyright information

© Chapman and Hall Ltd 1982

Authors and Affiliations

  • Tomoyuki Kakeshita
    • 1
  • Ken'ichi Shimizu
    • 1
  • Ryusuke Kawanaka
    • 2
  • Tomoharu Hasegawa
    • 3
  1. 1.Institute of Scientific and Industrial ResearchOsaka UniversityOsakaJapan
  2. 2.Kitaitami WorksMitsubishi Electric CorporationHyogoJapan
  3. 3.Consumer Products Research LaboratoryMitsubishi Electric CorporationKanagawaJapan

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