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Journal of Materials Science

, Volume 17, Issue 9, pp 2560–2566 | Cite as

Grain size effect of electro-plated tin coatings on whisker growth

  • Tomoyuki Kakeshita
  • Ken'ichi Shimizu
  • Ryusuke Kawanaka
  • Tomoharu Hasegawa
Article

Abstract

Tin and tin-lead coatings electro-plated in various solutions have been observed by means of high voltage electron microscopy, and the grain size effect of the coatings on whisker growth has been examined. As a result, it was found that the tin and tin-lead coatings from which whiskers hardly grew consisted of well-polygonized grains which were a few micrometre in size, and that the tin coatings from which whiskers easily grew consisted of irregular-shaped grains which were a few tenths of a micrometre in size. The irregularshaped grains contained dislocation rings which might be formed by clustering of vacancies or interstitial atoms upon electro-plating.

Keywords

Polymer Grain Size Microscopy Electron Microscopy High Voltage 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Chapman and Hall Ltd 1982

Authors and Affiliations

  • Tomoyuki Kakeshita
    • 1
  • Ken'ichi Shimizu
    • 1
  • Ryusuke Kawanaka
    • 2
  • Tomoharu Hasegawa
    • 3
  1. 1.Institute of Scientific and Industrial ResearchOsaka UniversityOsakaJapan
  2. 2.Kitaitami WorksMitsubishi Electric CorporationHyogoJapan
  3. 3.Consumer Products Research LaboratoryMitsubishi Electric CorporationKanagawaJapan

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