Journal of Materials Science

, Volume 12, Issue 8, pp 1666–1672 | Cite as

The temperature and strain rate dependence of the flow stress of tantalum

  • K. G. Hoge
  • A. K. Mukherjee
Papers

Abstract

The temperature and strain rate dependence of the flow stress of tantalum was studied between 78 to 800 K at strain rates from 10−5 to 2×104 sec−1. The effect of temperature and strain rate on the lower yield stress can be explained by a model incorporating the combined operation of the Peierls mechanism and dislocation drag processes. The general behaviour of the stress—strain curve at various strain rates and temperatures is analysed in terms of a rate—temperature parameter.

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Copyright information

© Chapman and Hall Ltd 1977

Authors and Affiliations

  • K. G. Hoge
    • 1
  • A. K. Mukherjee
    • 2
  1. 1.Energy Research and Development AdministrationWashington, D.C.USA
  2. 2.Department of Mechanical Engineering and Materials and Devices Research GroupUniversity of CaliforniaDavisUSA

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