Fracture toughness in mode I was determined for wood bonded with various adhesive systems. Tapered double-cantilever beam (TDCB) specimens were used, with attached transducer connected to instrumentation for monitoring acoustic emission. Adhesives used fro bonding the TDCB specimens included urea-formaldehyde resin, phenol-resorcinol resin, and emulsion polymer isocyanate, among others. Test parameters measured included critical load for cleavage fracture and number of events (stress waves) emitted, from which fracture toughness and cumulative count of acoustic emission were computed. It was found that there was a well defined, linear relation between fracture toughness and cumulative counts of acoustic emission per fracture area. The fracture toughness values of systems containing polyvinyl acetate and of epoxy resin were larger than those of thermosetting resins such as urea-or phenol formaldehyde. The high fracture toughness imparted by polyvinyl acetate was attributed to viscous movement of linear molecular chain segments, as compared with the more brittle behavior of the crosslinked molecular structure of such resins as ureaformaldehyde.
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Suzuki, M., Schniewind, A.P. Relationship between fracture toughness and acoustic emission during cleavage failure in adhesive joints. Wood Sci.Technol. 21, 121–130 (1987). https://doi.org/10.1007/BF00376192
- Fracture Toughness
- Acoustic Emission
- Polyvinyl Acetate
- Cleavage Fracture