Advertisement

Journal of Materials Science

, Volume 30, Issue 1, pp 185–195 | Cite as

Corrosion of aluminium nitride substrates in acid, alkaline solutions and water

  • Chung -Daw Young
  • Jenq -Gong Duh
Papers

Abstract

Aluminium nitride substrates were immersed in acid, basic solutions and deionized water for 1–120 h at room temperature. The corrosion rates are higher in basic solutions (NaOH and KOH) than those in acid solutions (CH3COOH, HCOOH, HNO3, HCl and H2SO4) and deionized water. The weight loss of AIN corroded in alkali aqueous reaches 70% and results in an increase in surface roughness ranging from 10 nm to 7 μm after 3 days corrosion. However, the weight loss in acid solution is only 1/700 of the alkali case. Violent chemical reactions between AIN and basic solutions were observed. Na2O, or Na2Al2O4·6H2O, is the intermediate product, and NaOH is a catalytic agent of the reaction. The surface morphology of the AIN etched by alkaline solutions is coral-like in microscopic view and appears like hills. In contrast, only several atomic layers of AIN surface are etched off in acid solutions and in deionized water. The lightly etched surface is mirror-like and flat, and the shapes of the grains are visible under the microscope, as the corrosion rate of each AIN grain varies with different crystal orientations. Consequently, after etching in acid solutions, the resulting microscopic surface morphology looks like a map of a jigsaw puzzle.

Keywords

Surface Roughness Acid Solution Surface Morphology Corrosion Rate Alkaline Solution 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. 1.
    T. Osaka, N. Hagata, E. Nakajima, I. Koiwa and K. Utsumi, J. Electrochem. Soc. 133 (1986) 2345.Google Scholar
  2. 2.
    K. K. Srivastava, M. Zulfequar and A. Kumar, J. Mater. Sci. 25 (1990) 2861.Google Scholar
  3. 3.
    K. K. Srivastava and A. Kumar, Mater. Sci. Technol. 6 (1990) 137.Google Scholar
  4. 4.
    R. B. Heslop and K. Jones, “Inorganic Chemistry” (Elsevier, Amsterdam, 1976) p. 341.Google Scholar
  5. 5.
    Y. Kurihara, T. Endoh and K. Yamada, IEEE Trans. Compos. Hybrids Manuf. Technol. 12 (1989) 330.Google Scholar
  6. 6.
    R. Chanchani, ibid. 11 (1988) 427.Google Scholar
  7. 7.
    A. Abid, R. Bensalem and B. J. Sealy, J. Mater. Sci. 21 (1986) 1301.Google Scholar
  8. 8.
    Y. Pauleau, A. Bouteville, J. J. Hantzpergue, J. C. Remy and A. Cachard, J. Elect. Chem. Soc. Solid State Sci. Technol. 129 (1982) 1045.Google Scholar
  9. 9.
    K. M. Taylor and E. Lenie, J. Electrochem. Soc. 107 (1960) 308.Google Scholar
  10. 10.
    G. Long and L. M. Foster, J. Am. Ceram. Soc. 42 (1959) 53.Google Scholar
  11. 11.
    T. Osaka, T. Asada, E. Nakajima and I. Koiwa, J. Electrochem. Soc. 135 (1988) 2578.Google Scholar
  12. 12.
    L. M. Sheppard, Ceram. Bull. 69 (1990) 1801.Google Scholar
  13. 13.
    G. A. Slack and T. F. McNelly, J. Crystal Growth 34 (1976) 263.Google Scholar
  14. 14.
    M. Trontelj and D. Kolar, J. Mater. Sci. 8 (1973) 136.Google Scholar
  15. 15.
    N. Kuramoto and Taniguchi, J. Mater. Sci. Lett. 3 (1984) 471.Google Scholar
  16. 16.
    B. S. Chiou and C. D. Young, in “42nd Electronic Components and Technology Conference”, San Diego, CA, Electronic Industry Association; Components, Hybrides & Manufacturing Technology Society (IEEE, New York, 1992) p. 692.Google Scholar
  17. 17.
    B. S. Chiou, J. H. Chang and J. G. Duh, Plat. Surf. Fin. 1 (1993) 65.Google Scholar

Copyright information

© Chapman & Hall 1995

Authors and Affiliations

  • Chung -Daw Young
    • 1
  • Jenq -Gong Duh
    • 1
  1. 1.Department of Materials Science and EngineeringNational Tsing Hua UniversityHsinchuTaiwan

Personalised recommendations