The effects of oxygen on diamond synthesis by hot-filament chemical vapor deposition
Abstract
The effects of oxygen addition on the synthesis of diamond are extensively studied by using the hot-filament chemical vapor deposition (HFCVD) method, in which it is simple and easy to control the deposition parameters independently. Diamond films are deposited on silicon wafers under the conditions of substrate temperature 530–950 ‡C; total reaction pressure 700–8000 Pa; and methane concentration 0.4–2.4% in both CH4–H2 and CH4–H2–O2 systems.
At deposition conditions of low substrate temperature, high CH4 concentration or high total pressure, soot-like carbon and/or graphite are deposited without oxygen addition. When even a small amount of oxygen (about 0.6%) is added, well-faceted diamond films are observed in scanning electron microscopy micrographs and a sharp diamond peak in the Raman spectra appears. The range of deposition parameters for high-quality diamond syntheses are extended by oxygen addition (low substrate temperature, high methane concentration and high reaction pressure).
Keywords
Silicon Wafer Reaction Pressure Methane Concentration Diamond Film Deposition ParameterPreview
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References
- 1.K. E. SPEAR, J. Amer. Ceram. Soc. 72 (1989) 171.Google Scholar
- 2.S. MATSUMOTO, Y. SATO, M. TSUTSUMI and N. SETAKA, J. Mater. Sci. 17 (1982) 3106.Google Scholar
- 3.J. S. KIM, M. H. KIM, S. S. PARK and J. Y. LEE, J. Appl. Phys. 67 (1990) 3354.Google Scholar
- 4.M. KAMO, Y. SATO, S. MATSUMOTO and N. SETAKA, J. Cryst. Growth 62 (1983) 642.Google Scholar
- 5.Y. MITSUDA, Y. KOJIMA, T. YOSHIDA and K. AKASHI, J. Mater. Sci. 22 (1987) 1557.Google Scholar
- 6.D. W. KWEON and J. Y. LEE, J. Appl. Phys. 69 (1991) 8329.Google Scholar
- 7.D. W. KWEON and J. Y. LEE, J. Mater. Sci. Lett. 11 (1992) 1043.Google Scholar
- 8.Y. SAITO, J. Mater. Sci. 23 (1988) 842.Google Scholar
- 9.J. J. CHANG and T. D. MANTEI, J. Appl. Phys. 71 (1992) 2918.Google Scholar
- 10.C. H. WU, M. A. TAMOR, T. J. POTTER and E. W. KAISER, J. Appl. Phys. 68 (1990) 4825.Google Scholar
- 11.S. J. HARRIS and A. M. WEINER, Appl. Phys. Lett. 55 (1989) 2179.Google Scholar
- 12.J. A. MUCHA, D. L. FILAMM and D. E. IBBOTSON, J. Appl. Phys. 65 (1989) 3448.Google Scholar
- 13.T. KAWATO and K. KONDO, Jpn. J. Appl. Phys. 26 (1987) 1429.Google Scholar
- 14.F. M. CERIO, W. A. WEIMER and C. E. JOHNSON, J. Mater. Res. 7 (1992) 1195.Google Scholar
- 15.S. S. PARK and J. Y. LEE, J. Appl. Phys. 69 (1991) 2618.Google Scholar
- 16.D. K. KIM, H. C. LEE and J. Y. LEE, J. Mater. Sci. 28 (1993) 6704.Google Scholar
- 17.W. ZHU, C. A. RANDALL, A. R. BADZIAN and R. MESSIER, J. Vac. Sci. Technol. A7 (1989) 2315.Google Scholar
- 18.Y. LIOU, A. INSPEKTOR, R. WEIMER, D. KNIGHT and R. MESSIER, J. Mater. Res. 5 (1990) 2305.Google Scholar
- 19.M. Frenklach and K. E. Spear, J. Mater. Res. 3 (1988) 133.Google Scholar
- 20.J. WARNATZ, in “Combustion Chemistry”, edited by W. C. GARDINER Jr (Springer-Verlag, New York, 1984) p. 203.Google Scholar
- 21.K. TAKEUCHI and T. YOSHIDA, J. Appl. Phys. 71 (1992) 2636.Google Scholar
- 22.E. KONDOH, T. OHTA, T. MITOMO and K. OHTSUKA, J. Appl. Phys. 72 (1992) 705.Google Scholar
- 23.C. E. JOHNSON, W. A. WEIMER and F. M. CERIO, J. Mater. Res. 7 (1992) 1427.Google Scholar
- 24.C. J. CHU, M. P. D'EVELYN, R. H. HAUGE and J. L. MARGRAVE, J. Mater. Res. 5 (1990) 2405.Google Scholar
- 25.S. WIEDEMAN, M. SMOOT and B. FIESELMANN, Appl. Phys. Lett. 54 (1989) 1539.Google Scholar
- 26.D. E. ROSNER and J. P. STRAKEY, J. Phys. Chem. 77 (1973) 69.Google Scholar