International Journal of Fracture

, Volume 74, Issue 2, pp 181–197

Fracture mechanics of a shaft-loaded blister of thin flexible membrane on rigid substrate

  • Kai-Tak Wan
  • Yiu-Wing Mai
Article

Abstract

A shaft-loaded blister test has been developed to measure the interfacial energy W of a thin flexible polymeric film adhered to a rigid substrate. A theoretical analysis is given of an axisymmetric debond (‘blister’) in terms of an external applied load P, tensile stretching modulus E and thickness h of the adhering layer. The fracture mechanics model presented considers both elastic and elastoplastic deformations in the thin film. The intrinsic stable interface debonding process provides an attractive alternative to the conventional adhesion measurement techniques.

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Copyright information

© Kluwer Academic Publishers 1996

Authors and Affiliations

  • Kai-Tak Wan
    • 1
  • Yiu-Wing Mai
    • 1
  1. 1.Centre for Advanced Materials Technology, Department of Mechanical and Mechatronic EngineeringUniversity of SydneyAustralia
  2. 2.Department of Mechanical EngineeringHong Kong University of Science and TechnologyHong Kong

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