Fracture mechanics of a shaft-loaded blister of thin flexible membrane on rigid substrate
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A shaft-loaded blister test has been developed to measure the interfacial energy W of a thin flexible polymeric film adhered to a rigid substrate. A theoretical analysis is given of an axisymmetric debond (‘blister’) in terms of an external applied load P, tensile stretching modulus E and thickness h of the adhering layer. The fracture mechanics model presented considers both elastic and elastoplastic deformations in the thin film. The intrinsic stable interface debonding process provides an attractive alternative to the conventional adhesion measurement techniques.
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