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Surface Roughness of Optoelectronic Components in Mechanical Polishing

  • Investigation of Machining Processes
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Abstract

The investigation of the mechanism of mechanical polishing of optoelectronic components made of crystalline materials has demonstrated that the machined surface roughness parameters grow linearly with increasing most probable values of debris particle size and surface area, unit cell volume, and surface area of the crystal plane machined. The surface roughness parameters are shown to be inversely proportional to the energy spent for the debris particle formation. The relative surface roughness of the polished silicon carbide, gallium nitride, aluminum nitride, and sapphire workpieces is represented by the following ratio: 0.68: 0.67: 0.63: 1.00.

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Authors and Affiliations

  1. Bakul Institute for Superhard Materials, National Academy of Sciences of Ukraine, vul. Avtozavods’ka 2, Kiev, 04074, Ukraine

    Yu. D. Filatov

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  1. Yu. D. Filatov
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Correspondence to Yu. D. Filatov.

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Original Russian Text © Yu.D. Filatov, 2018, published in Sverkhtverdye Materialy, 2018, Vol. 40, No. 1, pp. 68–76.

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Filatov, Y.D. Surface Roughness of Optoelectronic Components in Mechanical Polishing. J. Superhard Mater. 40, 52–57 (2018). https://doi.org/10.3103/S1063457618010082

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