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Formulated poly (butyl vinyl ether) adhesives as alternative materials for direct ink writing (DIW) 3D printing

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A Correction to this article was published on 16 November 2023

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Abstract

Direct Ink Writing (DIW) is a promising 3D printing method for controlled multi-material deposition to make well-defined geometrical structures. Stringent rheological requirements enable the additive build-up of extruded layers. Although commercially available, no occasion has been reported on poly(butyl vinyl ether) adhesives for DIW. The moisture curing mechanism and thixotropic build-up indicate an alternative route to cross-linking curing to thermoset elastomers. Chemical composition and rheological characterizations were conducted to evaluate printability and physicochemical properties (i.e., dielectric properties, thermal conductivity, etc.) to address the potential for further reformulation and study with nanomaterial additives.

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Acknowledgments

We acknowledge technical support from Frontier Laboratories and Quantum Analytics. This work (or part of this work) was conducted in Oak Ridge National Laboratory Center for Nanophase Materials Sciences (CNMS) by R C Advincula. CNMS is a US Department of Energy Office of Science User Facility.

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Basic Energy Sciences.

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Authors and Affiliations

  1. Department of Chemical and Biomolecular Engineering, Department of Materials Science and Engineering and Institute for Advanced Materials and Manufacturing (IAMM), The University of Tennessee, Knoxville, TN, 37996, USA

    Anh Nguyen, Charles Patten, Zane Smith & Rigoberto Advincula

  2. Department of Macromolecular Sciences and Engineering, Case Western Reserve University, Cleveland, OH, 44106, USA

    G. M. Fazley Elahee, Xiang Cheng, Lihan Rong, Chase Breting, Jin Ge, Mingwei Xu, Matthew Yang & Rigoberto Advincula

  3. Advanced Functional Materials and Nanotechnology Group, Centro de Investigación en Materials Avanzados S. C. (CIMAV-Unidad Monterrey), 66628 C.P., Apodaca, Nuevo León, Mexico

    Jose Bonilla-Cruz & Tania Ernestina Lara Ceniceros

  4. Center for Nanophase Materials and Sciences, Oak Ridge National Laboratory, Oak Ridge, TN, 37830, USA

    Rigoberto Advincula

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  1. Anh Nguyen
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This article was updated to correct reference 32. The title of the cited article was truncated.

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Nguyen, A., Elahee, G.M.F., Cheng, X. et al. Formulated poly (butyl vinyl ether) adhesives as alternative materials for direct ink writing (DIW) 3D printing. MRS Communications 13, 1407–1415 (2023). https://doi.org/10.1557/s43579-023-00477-5

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