Abstract
A charge-injection GeTe/Sb2Te3 superlattice phase change memory (PCM or PRAM) has been developed as a candidate for a non-volatile memory that replaces NAND flash memory. It differs from PRAM with the conventional material of GeSbTe, and is therefore named “TRAM (topological switching random access memory)”. First principle calculations showed a resistance change in the GeTe/Sb2Te3 superlattice was enhanced by charge injection. The fabrication and analyses of a one-resistor TEG revealed that the superlattice structure was maintained after 1M endurance, which proved the occurrence of non-melting resistance change in TRAM. The reset current of TRAM was found to be less than 1/5 of that of conventional PRAM. Furthermore, TRAM enables a set -speed of 10 ns and reset -operation by DC-sweep to be achieved, which experimentally proved the atomic movement in TRAM can be enhanced by charge injection.
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References
THE 3rd. REPORT Ultra Low Voltage Device Project for Low-Carbon Society (in Japanese), http://www.leap.or.jp/seikahoukokukai3.pdf, 68, January 2014.
R. Freitas and W. W. Wilcke, IBM Journal of Research and Development, 52(4/5), 439–448 (2008).
S. Ovshinsky, Phys. Rev. Lett., 21, 1450–1453 (1968).
Phase Change Materials: Science and Applications, edited by S. Raoux, M. Wutting, (Springer, 2009).
Y. Sasago, M. Kinoshita, T. Morikawa, K. Kurotsuchi, S. Hanzawa, T. Mine, A. Shima, Y. Fujisaki, H. Kume, H. Moriya, N. Takaura, and K. Torii, 2009 Symposium on VLSI Technology, 24–25, June 2009.
Numonyx JSPCM128A00B85ES SAR-0905-803 (Chipworks, 2009).
Samsung K571229ACM-BQ12 512Mbit PCM 65nm BiCMOS PCM Process PPR-1012-803 (Chipworks, 2011).
Micron MT66R7072A10AB5ZZW 1Gbit Phase Change Memory 45 nm BiCMOS PCM Process (Chipworks, 2013).
A. Akel, A.M. Caulfield, T.I. Mollov, R.K. Gupta, R. Jhala, and S. Swanson, 2011 Proceedings of the 3rd USENIX conference on Hot topics in storage and file systems, https://www.usenix.org/legacy/events/hotstorage11/tech/slides/akel.pdf, June 2011.
N. Matsuzaki, K. Kurotsuchi, Y. Matsui, O. Tonomura, N. Yamamoto, Y. Fujisaki, N. Kitai, R. Takemura, K. Osada, S. Hanzawa, H. Moriya, T. Iwasaki, T. Kawahara, N. Takaura, M. Terao, M. Matsuoka, and M. Moniwa, 2005 IEEE International Electron Devices Meeting (IEDM 2005), 31.1, December 2005.
T. Morikawa, K. Kinoshita, M. Matsuzaki, N. Matsui, Y. Fujisaki, Y. Hanzawa, S. Kotabe, A. Terao, M. Moriya, H/ Iwasaki, T. Matsuoka, M. Nitta, F. Moniwa, M. Koga, N. Takaura, 2007 IEEE International Electron Devices Meeting (IEDM 2007), 307–310, December 2007.
T. Morikawa, K. Akita, T. Ohyanagi, M. Kitamura, M. Kinoshita, M. Tai, and N. Takaura, 2012 IEEE International Electron Devices Meeting (IEDM 2012), 737–740, December 2012.
T. C. Chong, L. P. Shi, X. S. Miao, P. K. Tan, R. Zhao and Z. P. Cai, Jpn. J. Appl. Phys., 39, 737–740 (2000).
J. Tominaga, T. Shima, P. Fons, R. Simpson, M. Kuwahara, and A. Kolobov, Jpn. J. Appl. Phys., 48, 03A053 (2009).
J. Tominaga, R. Simpson, P. Fons, and A. Kolobov, Proceedings of EPCOS 2010, 54–59, September 2010.
N. Takaura, T. Ohyanagi, M. Tai, M. Kitamura, M. Kinoshita, K. Akita, T. Morikawa, S. Kato, M. Araidai, K. Kamiya, T. Yamamoto and K. Shiraishi, 2014 IEEE International Conference on Microelectronic Test Structure(ICMTS2014), 2.2, March 2014.
N. Takaura, T. Ohyanagi, T. Morikawa, S. Kitamura, M. Tai, M. Kinoshita, K. Akita, J. Tominaga, Proceedings of EPCOS 2013, 119–120, September 2013.
R. E. Simpson, P. Fons, A.V. Kolobov, T. Fukaya, M. Krbal, T. Yagi, and J. Tominaga, Nature Nanotechnology, 6, 501–505 (2011).
A. V. Kolobov, P. Fons, A. I. Frenkel, A. L. Ankudinov, J. Tominaga, and T. Uruga: Nature Materials., 3, 703 (2004).
S. Kato, M. Araidai, K. Kamiya, T. Yamamoto, T. Ohyanagi, N. Takaura, and K. Shiraishi, 2013 International Conference on Solid State Devices and Materials (SSDM2013), 544–545, September 2013.
N. Takaura, T. Ohyanagi, M. Kitamura, M. Tai, M. Kinoshita, K. Akita, T. Morikawa, S. Kato, M. Araidai, K. Kamiya, T. Yamamoto, K. Shiraishi, 2013 symposium on VLSI technology, T130–T131, June 2013
K. Shiraishi, M.Y. Yang, S. Kato, M. Araidai, K. Kamiya, T. Yamamoto, T. Ohyanagi, N. Takaura, M. Niwa, B. Magyari-Kope, and Y. Nishi, 2013 International Conference on Solid State Devices and Materials(SSDM2013), 574–575, September 2013.
K. Kamiya, M.Y. Yang, B. Magyari-K¨ope, M. Niwa, Y. Nishi, and K. Shiraishi, 2012 IEEE International Electron Devices Meeting (IEDM 2012), 478–481, December 2012.
B. Sa, J. Zhou, Z. Sun, J. Tominaga, and R. Ahuja, Phys. Rev. Lett., 109, 096802 (2012)
J. Tominaga, A. V. Kolovov, P. Fons, X. Wang, J. Richter, Y. Saito, and T. Nakano, S. Murakami, Proceedings of EPCOS 2013, 5–7, September 2013.
To be published in VLSI Technology 2014
J. Tominaga, A. V. Kolobov, P. Fons, T. Nakano, and S. Murakami, Adv. Mater. Interfaces 2013, DOI: 10.1002/admi.201300027
T. Ohyanagi, N. Takaura, M. Kitamura, M. Tai, M. Kinoshita, K. Akita, T. Morikawa, S. Kato, M. Araidai, K. Kamiya, T. Yamamoto, K. Shiraishi, 2013 IEEE International Electron Devices Meeting (IEDM 2012), 30.5, December 2013.
T. Ohyanagi, N. Takaura, M. Kitamura, M. Tai, M. Kinoshita, K. Akita, T. Morikawa, and J. Tominaga, Jpn. J. Appl. Phys., 52, 05FF01 (2013).
G. W. Burr, M. J. Breitwisch, M. Franceschini, D. Garetto, K. Gopalakrishnan, B. Jackson, B. Kurdi, C. Lam, L. A. Lastras, A. Padilla, B. Rajendran, S. Raoux, and R. Shenoy, Journal of Vacuum Science & Technology B, 28(2), 223–262 (2010)
G. Feng, B. Liu, Z. Song, S. Lv, L. Wu, and S. Feng, J. Nanosci. And Nanotechnol., 9, 1526 (2009).
S. Kato, M. Araidai, T. Ohyanagi, N. Takaura, K. Shiraishi, 19th Workshop on Gate Stack Technology and Physics (in Japanese), 69–72, January 2014.
M. Kitamura, T. Morikawa, T. Ohyanagi, M. Tai, M. Kinoshita, K. Akita, and N. Takaura, 2013 International Conference on Solid State Devices and Materials (SSDM2013), 546–547, September 2013.
T. Morikawa, M. Kitamura, T. Ohyanagi, M. Tai, M. Kinoshita, K. Akita, and N. Takaura, Advanced Metallization Conference 2013 (ADMETA plus 2013), 7.6, October 2013.
Y. Saito, J. Tominaga, P. J. Fons, A. V. Kolobov, Proceedings of EPCOS 2013, 123–125, September 2013.
acknowledgments
The author would like to thank T. Ohyanagi, M. Tai, M. Kitamura, M. Kinoshita, T. Morikawa, and K. Akita for device fabrication. The author also would like to thank to K. Shiraishi, S. Kato, M. Araidai, T. Yamamoto, and K. Kamiya for theoretical calculation. The author expresses thanks to J. Tominaga and Y. Saito for discussion of materials research. This work was performed as “Ultra-Low Voltage Device Project ” funded and supported by METI and NEDO. Device processing was operated by SCR operation office, AIST, Japan.
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Takaura, N. Theoretical and Experimental Understanding of Charge-Injection GeTe/Sb2Te3 Superlattice Phase Change Memory. MRS Online Proceedings Library 1697, 12–23 (2014). https://doi.org/10.1557/opl.2014.549
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DOI: https://doi.org/10.1557/opl.2014.549