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Modulating crack propagation in a multilayer stack with a super-layer

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Abstract

Quantitative characterization of interface adhesion and fracture properties of thin film materials is of fundamental and technological interests in modern technologies. Sandwich beam specimens used in fracture mechanics techniques, such as four-point bending and double-cantilever beam have been widely adopted, including the semiconductor industry. In this work, we highlight some of the challenges that these techniques are facing in characterizing ever thinner films and tough interfaces, and propose a simple strategy to address these challenges by engineering the stack structure of the specimen. We show that crack propagation in a multilayer stack can be controlled using a super-layer (SL) structure, and the dependence of the cracking behavior on the thickness and mechanical properties of the SL is studied. The effectiveness of the SL strategy is demonstrated for a range of technologically important material systems used in the on-chip interconnects of modern microprocessors, which represents one promising path to extend the industry-standard techniques to meet future characterization needs.

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ACKNOWLEDGMENTS

H.L. acknowledges Portland Technology Development of Intel Corporation for supporting test wafers. Special thanks go to Jimmy Liu of Intel Corporation for 4PB and DCB testing.

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  1. Technology Manufacture Group (TMG), Intel Corporation, Hillsboro, Oregon, 97124, USA

    Han Li, Asad Iqbal & John D. Brooks

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  1. Han Li
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Correspondence to Han Li.

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Li, H., Iqbal, A. & Brooks, J.D. Modulating crack propagation in a multilayer stack with a super-layer. Journal of Materials Research 30, 3065–3070 (2015). https://doi.org/10.1557/jmr.2015.252

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