Abstract
Based on qualitative and quantitative criteria, solvents compatible with polymethyl methacrylate (PMMA) such as ethyl acrylate, n-butylacrylate, and vinyl acetate were selected. Features of the solvent-bonded seam of non-detachable bonding of PMMA of various grades obtained using the selected solvents were investigated. It is shown that the method of chemical solvent bonding with vinyl acetate can be an alternative to gluing in sealing of microchips, since the solvent-bonded seam makes a smaller contribution to the change in the working volume of microstructures than the glue seam.
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This work was carried out within the framework of state assignment of the Ministry of Science and Higher Education of the Russian Federation no. 075-01073-20–00.
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Lukashenko, T.A., Zubik, A.N., Bulyanitsa, A.L. et al. Solvents for Sealing Microfluidic Devices Made of Polymethyl Methacrylate by Chemical Solvent Bonding. Polym. Sci. Ser. D 14, 350–355 (2021). https://doi.org/10.1134/S1995421221030175
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DOI: https://doi.org/10.1134/S1995421221030175