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On the Formation of a Relief on the Surface of Tantalum during Its Sintering

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Abstract

Structural changes in FTW60 and FTW8000 tantalum capacitor powders after sintering at different temperatures are investigated by X-ray diffraction and scanning electron microscopy. Sintering is carried out in accordance with the current technological process used in the production of oxide–semiconductor capacitors. The anodes obtained as a result of sintering are bulk-porous bodies in the form of a rectangular parallelepiped with a wire lead. On the free surface of the bulk-porous anodes obtained by sintering the FTW60 powder at temperatures of 1800°C and 1920°C, the formation of a wavy relief is observed. No such relief is observed after sintering the FTW800 powder at 1250°C. After analyzing the structural state and the morphology of the initial powders and the anodes obtained as a result of sintering, a phenomenological model of the formation of such a relief is proposed based on collective recrystallization near the free surface during high-temperature exposure.

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ACKNOWLEDGMENTS

This work was carried out using equipment of the Collective Use Center “Center of the physical and physical-chemical methods of analysis of the properties of surface, nanostructures, materials and parts” and the “Scientific Center of Metallurgical Physics and Materials Science” of Udmurt Federal Research Center, Ural Branch, Russian Academy of Sciences.

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Authors and Affiliations

  1. Scientific Center of Metallurgical Physics and Materials Science, Udmurt Federal Research Center, Ural Branch, Russian Academy of Sciences, 426001, Izhevsk, Russia

    B. E. Pushkarev, R. M. Nikonova & V. I. Lad’yanov

  2. Joint Scientific Center ELECOND, 427968, Sarapul, Udmurt Republic, Russia

    S. V. Rybin & A. V. Stepanov

Authors
  1. B. E. Pushkarev
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  2. R. M. Nikonova
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  3. V. I. Lad’yanov
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  4. S. V. Rybin
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  5. A. V. Stepanov
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Correspondence to B. E. Pushkarev.

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Translated by Yu. Ryzhkov

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Pushkarev, B.E., Nikonova, R.M., Lad’yanov, V.I. et al. On the Formation of a Relief on the Surface of Tantalum during Its Sintering. J. Surf. Investig. 15 (Suppl 1), S131–S136 (2021). https://doi.org/10.1134/S1027451022020343

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  • DOI: https://doi.org/10.1134/S1027451022020343

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