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Effect of Thiourea on Electrodeposited Co–Mg–Nd Alloy Coating in Deep Eutectic Solvents

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Abstract

Potentiostatic technique was used to investigate the effect of additive thiourea on the deposition mechanism of Co2+ in choline chloride–urea eutectic solvent system. The Co–Mg–Nd ternary alloy coating was prepared by linear scanning technique which was used to study the electrochemical behavior of Co2+, Mg2+ and Nd3+ in the system and the corrosion resistance of alloy coatings. The results show that Co2+ follows the growth mechanism of three-dimensional continuous nucleation in choline chloride–urea eutectic system. When the amount of thiourea added exceeds 300 mg, the nucleation mode of Co2+ approaches the three-dimensional instantaneous nucleation. The cathodic polarization curves of Co2+, Mg2+, and Nd3+ in the choline chloride–urea system shows a trend of weakening first and then increasing with the increase of thiourea content. At the addition of 100 mg, the cathodic polarization of the films was the strongest, which was conducive to deposite. According to the Ecorr and Icorr obtained by tafel curve, it is found that adding thiourea in the plating solution system could change the corrosion resistance of the coating. When the content was less than 100 mg, the corrosion resistance of the coating is the best. With the thiourea content increasing, the corrosion resistance of the coating is gradually weakening. It is found that the plating solution with 100 mg thiourea added can prepare Co–Mg–Nd ternary alloy coating with excellent coating morphology, high rare earth content and stable compound, by SEM, EDX and XRD analysis.

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ACKNOWLEDGMENTS

The author would like to thank the co-authors for their help in conception and language.

Funding

FUNDING: This work was supported bythe qinghai basic research program project [grant no. 2016-ZJ-753]; the National nature fund project [grant no. 21553002].

CONFLICT OF INTEREST: The authors declare that they have no conflict of interest.

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Authors and Affiliations

  1. Qinghai Normal University, Collegel of Chemistry and Chemical Engineering, 810008, Qinghai, China

    Tong-tong Xiong, Bi-qing Chen, Miao Li, Chan Du, Yunna Zhu, Shimin Zhang & Jing Zhao

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  1. Tong-tong Xiong
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  2. Bi-qing Chen
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Correspondence to Bi-qing Chen.

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Tong-tong Xiong, Chen, Bq., Li, M. et al. Effect of Thiourea on Electrodeposited Co–Mg–Nd Alloy Coating in Deep Eutectic Solvents. Russ J Electrochem 57, 51–61 (2021). https://doi.org/10.1134/S1023193521010109

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