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Dynamic Behaviors of Thermal–Electric Imperfect Functionally Graded Piezoelectric Sandwich Microplates Based on Modified Couple Stress Theory

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Abstract

Introduction

Based on the modified couple stress theory and the hyperbolic tangential mixed shear deformation theory, the free vibration and the transient responses of the functionally graded piezoelectric (FGP) sandwich microplates with considering the thermal–electric effects are investigated.

Methods

By introducing the porosity volume fraction, the perfect FGP sandwich mocroplate are destroyed and porous FGP sandwich plates are constructed. Electro-elastic material properties of porous FGP microplate vary across the thickness based on the modified power-law model. The governing equations derived from Hamilton's principle are solved analytically.

Results

By comparisons with the FEM simulation results and the previous results in the literature, the accuracy of the present established models is confirmed. Then the influences of thermal loadings, porosity volune fraction, material gradation, length scale to thickness ratios and facesheet thickness on the dynamic behaviors of FGP sandwich microplates are discussed.

Significance

These research can provide a theoretical basis for the accurate design of smart structures made of functionally graded piezoelectric materials.

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Acknowledgements

The authors gratefully acknowledge the support from the Beijing Natural Science Foundation (No.1222006) and the Natural Science Foundation of China (Grant Nos.11732005, 12172339).

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Correspondence to Feng-Lian Li.

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Li, FL., Fan, SJ., Hao, YX. et al. Dynamic Behaviors of Thermal–Electric Imperfect Functionally Graded Piezoelectric Sandwich Microplates Based on Modified Couple Stress Theory. J. Vib. Eng. Technol. 11, 2387–2401 (2023). https://doi.org/10.1007/s42417-022-00709-3

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  • DOI: https://doi.org/10.1007/s42417-022-00709-3

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