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Deformation mechanism of various Sn-xBi alloys under tensile tests

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Abstract

In this study, the thermal properties, mechanical properties, and microstructure evolution of Sn-xBi (x = 0, 10, 17, 20, 30, 40, 50, and 58 wt.%, respectively) alloys were investigated via differential scanning calorimetry, scanning electron microscope during and after tensile test. The results reveal that the shapes of precipitated Bi particles relate to the cooling rate, that is, sphere in water cooling condition and short rod like cooled in air. Beta tin phase strengthened by Bi particle precipitation offers superior performance than Sn-Bi eutectic structure. The result also clearly demonstrates the deformation and fracture modes of Sn-Bi alloys with different microstructure through in situ observations during tensile loading. The deformation of Sn-17Bi alloy deforms based on the grain boundary diffusion. For Sn-58Bi alloy, the deformation is mainly resulted by grain boundary sliding during even deformation stage and the phase sliding between Bi-rich and Sn-rich phase boundary after necking. And the latter accounts for the majority. Sn-50Bi alloy deforms through grain boundary sliding of eutectic phase and phase boundary sliding between beta tin phase strengthen by precipitated Bi and eutectic phase. Moreover, Sn-rich phase works as floating grains, does not participate in the deformation, but provides sliding interface with the eutectic part, which promotes the continuous plastic deformation.

Graphical abstract

Sn-50Bi alloy deforms through slip between grain boundaries within eutectic region and phase boundary sliding between beta tin phase and eutectic phase.

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Data availability

The data used to support the findings of this study are available from the corresponding author upon request.

References

  1. Cheng S, Huang C, Pecht M (2017) A review of lead-free solders for electronics applications. Microelectron Reliab 75:77–95

    Article  CAS  Google Scholar 

  2. Gao N et al (2017) The effect of the material and size of the flip-chip plastic package on warping, in 18th International Conference on Electronic Packaging Technology (ICEPT) p. 352–356

  3. Hu M, Kresge L, Lee N(2013) Low-cost high-reliability assembly of thermally warped PoP with novel epoxy flux on solder paste, in 14th International Conference on Electronic Packaging Technology(ICEPT). p. 173–181

  4. Powers TA, Singler TJ, Clum JA (1994) Role of tin content in the wetting of Cu and Au by tin-bismuth solders. J Electron Mater 23:773–778

    Article  CAS  Google Scholar 

  5. Morgana Ribas,Anil Kumar, Divya Kosuri, Raghu R. Rangaraju, Pritha Choudhury,Suresh Telu, Siuli Sarkar(2017) Low temperature soldering using Sn-Bi alloys, in Proceedings of SMTA International. Rosemont. IL, USA  

  6. ​Morgana Ribas, Tom Hunsinger, Traian Cucu, Ramakrishna H V, Garian Lim, Mike Murphy(2018) (The printed circuit assembler’s guide to...™ -) Low-temperature soldering,BR Publishing, Inc. eBook ISBN:978-0-9998648-4-5  

  7. Hu FQ et al (2018) Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction. Mater Lett 214:142–145

    Article  CAS  Google Scholar 

  8. Li Y et al (2016) Improving the mechanical performance of Sn57.6Bi0.4Ag solder joints on Au/Ni/Cu pads during aging and electromigration through the addition of tungsten (W) nanoparticle reinforcement. Mater Sci Eng: A 669:291–303

    Article  CAS  Google Scholar 

  9. Wu X et al (2017) Microstructure and mechanical behavior of Sn-40Bi-xCu alloy. J Mater Sci: Mater Electron 28(20):15708–15717

    CAS  Google Scholar 

  10. Zhang H, Sun F, Liu Y (2019) Thermal and mechanical properties of micro Cu doped Sn58Bi solder paste for attaching LED lamps. J Mater Sci: Mater Electron 30(1):340–347

    Google Scholar 

  11. Kanlayasiri K, Kongchayasukawat RH (2018) Property alterations of Sn-0.6Cu-0.05Ni-Ge lead-free solder by Ag, Bi, In and Sb addition. Trans Nonferrous Met Soc China 28(6):1166–1175

    Article  CAS  Google Scholar 

  12. Zhu W et al (2019) Improved microstructure and mechanical properties for SnBi solder alloy by addition of Cr powders. J Alloy Compd 789:805–813

    Article  CAS  Google Scholar 

  13. Nan C et al (2017) Measurement and modeling of phase equilibria for Sb-Sn and Bi-Sb-Sn alloys in vacuum distillation. Fluid Phase Equilib 442:62–67

    Article  CAS  Google Scholar 

  14. Zhang C et al (2014) Effect of Sb content on properties of Sn-Bi solders. Trans Nonferrous Met Soc China 24(1):184–191

    Article  CAS  Google Scholar 

  15. Ma D, Wu P (2016) Improved microstructure and mechanical properties for Sn58Bi0.7Zn solder joint by addition of graphene nanosheets. J Alloys Compd 671:127–136

    Article  CAS  Google Scholar 

  16. Zhu QS et al (2009) Effect of Zn addition on microstructure of Sn-Bi joint, in 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT).  Beijing, China, p. 1043–1046

  17. Wang XJ et al (2014) Effect of doping Al on the liquid oxidation of Sn-Bi-Zn solder. J Mater Sci: Mater Electron 24:2297–2304

    Google Scholar 

  18. Chen X et al (2015) Effect of In on microstructure, thermodynamic characteristic and mechanical properties of Sn–Bi based lead-free solder. J Alloy Compd 633:377–383

    Article  CAS  Google Scholar 

  19. Kim SH et al (2017) Thermo-mechanical evolution of ternary Bi–Sn–In solder micropowders and nanoparticles reflowed on a flexible PET substrate. Appl Surf Sci 415:28–34

    Article  CAS  Google Scholar 

  20. Li Q et al (2016) Characterization of low-melting-point Sn-Bi-In lead-free solders. J Electron Mater 45(11):5800–5810

    Article  Google Scholar 

  21. Wu X et al (2020) Effect of In addition on microstructure and mechanical properties of Sn–40Bi alloys. J Mater Sci 55(7):3092–3106

    Article  CAS  Google Scholar 

  22. Zhao J et al (2004) Influence of Bi on microstructures evolution and mechanical properties in Sn–Ag–Cu lead-free solder. J Alloy Compd 375(1):196–201

    Article  CAS  Google Scholar 

  23. Zhang XP et al (2007) Creep and fatigue behaviors of the lead-free Sn–Ag–Cu–Bi and Sn60Pb40 solder interconnections at elevated temperatures. J Mater Sci: Mater Electron 18(6):665–670

    CAS  Google Scholar 

  24. Olofinjana A et al (2019) Studies of the solidification characteristics in Sn-Ag-Cu-Bi solder alloys. Procedia Manuf 30:596–603

    Article  Google Scholar 

  25. Zhao G, Wen G, Sheng G (2017) Influence of rapid solidification on Sn–8Zn–3Bi alloy characteristics and microstructural evolution of solder/Cu joints during elevated temperature aging. Trans Nonferrous Met Soc China 27(1):234–240

  26. El-Daly AA, Ibrahiem AA (2018) The role of delayed elasticity and stress relaxation in Sn-Bi-Cu lead-free solders solidified under permanent magnet stirring. J Alloy Compd 740:801–809

    Article  CAS  Google Scholar 

  27. Lai Z, Ye D (2016) Microstructure and properties of Sn-10Bi-xCu solder alloy/joint. J Electron Mater 45(7):3702–3711

    Article  CAS  Google Scholar 

  28. Silva BL, Garcia A, Spinelli JE (2017) Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys. J Alloy Compd 691:600–605

    Article  CAS  Google Scholar 

  29. Takao H, Yamada A, Hasegawa H (2004) Mechanical properties and solder Joint reliability of low-melting Sn-Bi-Cu lead free solder alloy. R&D Rev Toyota CRDL 39(2):41

    CAS  Google Scholar 

  30. Peng C et al (2011) Influence of minor Ag nano-particles additions on the microstructure of Sn30Bi0.5Cu solder reacted with a Cu substrate. J Mater Sci: Mater Electron 22(7):797–806

    CAS  Google Scholar 

  31. Zhang L, Sun L, Guo Y (2015) Microstructures and properties of Sn58Bi, Sn35Bi0.3Ag, Sn35Bi1.0Ag solder and solder joints. J Mater Sci: Mater Electron 26(10):7629–7634

    CAS  Google Scholar 

  32. Zang L et al (2012) Spreading process and interfacial characteristic of Sn-17Bi-0.5Cu/Ni at temperatures ranging from 523K to 673K. Colloids Surf A: Physicochem Eng Asp 414:57–65

    Article  CAS  Google Scholar 

  33. Zhou H et al (2021) Effect of Laser Power on Microstructure and Micro-Galvanic Corrosion Behavior of a 6061-T6 Aluminum Alloy Welding Joints. Metals 11(31)

  34. Abd El-Salam F et al (2009) Thermally induced variations in structural and mechanical properties of rapid solidified Tin-based alloys. Mater Sci Eng, A 506(1–2):135–140

    Article  Google Scholar 

  35. Zhang QK et al (2017) Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain. Mater Sci Eng, A 701:187–195

    Article  CAS  Google Scholar 

  36. Qiao YX, Corrosion YPC (2021) Behavior of a Nickel-free high-nitrogen stainless steel with hydrogen charging. JOM https://doi.org/10.1007/s11837-021-04569-2

    Article  CAS  Google Scholar 

  37. Kerr M, Chawla N (2004) Creep deformation behaviour of Sn-3.5Ag solder at small length scales. JOM 56(6):50–54

  38. Kerr M, Chawla N (2004) Creep deformation behavior of Sn–3.5Ag solder/Cu couple at small length scales. Acta Mater 52(15):4527–4535

    Article  CAS  Google Scholar 

  39. Okkerse B (1954) Self-diffusion in lead. Acta Metall 2:551–553

    Article  Google Scholar 

  40. Ding Y et al (2006) In situ TEM observation of microcrack nucleation and propagation in pure tin solder. Mater Sci Eng, B 127(1):62–69

    Article  CAS  Google Scholar 

  41. Qiao Y et al (2021) Effect of hydrogen charging on microstructural evolution and corrosion behavior of Ti-4Al-2V-1Mo-1Fe alloy. J Mater Sci Technol 60:168–176

    Article  Google Scholar 

  42. Han J, Guo F (2019) Double tricrystal nucleation behavior in Pb-free BGA solder joints. Microelectron Reliab 98:1–9

    Article  Google Scholar 

Download references

Funding

This study was funded by Yunnan Science and Technology Major Project (grant number 2019ZE001) and the Research and Development Funding of Yunnan Tin Group (Holding) Co, Ltd.

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Authors and Affiliations

  1. Yunnan Tin Group (Holding) Co. Ltd, Kunming, 650000, China

    Shanshan Cai, Xiaobin Luo & Jubo Peng

  2. Jiangsu University of Science and Technology, Zhenjiang, 212003, China

    Zhiqi Yu, Huiling Zhou, Ning Liu & Xiaojing Wang

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  1. Shanshan Cai
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  2. Xiaobin Luo
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  3. Jubo Peng
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  4. Zhiqi Yu
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  5. Huiling Zhou
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  7. Xiaojing Wang
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Correspondence to Jubo Peng or Xiaojing Wang.

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Cai, S., Luo, X., Peng, J. et al. Deformation mechanism of various Sn-xBi alloys under tensile tests. Adv Compos Hybrid Mater 4, 379–391 (2021). https://doi.org/10.1007/s42114-021-00231-2

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  • DOI: https://doi.org/10.1007/s42114-021-00231-2

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