Abstract
This article mainly focuses on the impact on interface trap charges (ITCs) on dual gate source-drain Schottky barrier tunnel field effect transistor (D-G-S-D-STFET) using a high-k dielectric material. Here the high-k material raises the coupling capacitance between the channel and the gate electrode, therefore increases the charge concentration more than a conventional device because of the additional dual-source region. A higher Ion/Ioff current ratio and a reduced off-state leakage are obtained in the design of D-G-S-D-STFET. Moreover, the comparison of the D-G-S-D-STFET device is made with both the dual-metal gate TFET and conventional STFET. Further, the DC and analog/RF performances are characterized by Silvaco TCAD in terms of transfer characteristics (ID–VGS), cut-off frequency (fT), transconductance (gm), gain bandwidth product (GBP), transconductance generation factor (TGF), and transconductance frequency product (TFP). Comparatively to the conventional structures at a gate length of 40 nm has been observed that the Cut-off Frequency (fT) and the TGF are increased in the proposed device to 60 GHz and 259 V−1 range respectively with the positive and negative trap charges. Hence, the results verify that the D-G-S-D-STFET is more suitable for high-frequency applications.
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The datasets generated during and/or analyzed during the current study are available from the corresponding author on reasonable request.
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Anusuya, P., Kumar, P. Analysis of interface trap charges on RF/analog performances of dual-gate-source-drain Schottky FET for high-frequency applications. Multiscale and Multidiscip. Model. Exp. and Des. (2024). https://doi.org/10.1007/s41939-024-00419-1
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DOI: https://doi.org/10.1007/s41939-024-00419-1