Abstract
In this study, we proposed a new real-time internal stress measurement design based on bending deformation of electroplated specimen. The volume change of fluid compartment caused by bending deformation of specimen on the wall was measured by fluid column height in a glass tube, and then the variation of internal stress could be calculated according to the Stoney formula. There are many factors that can cause variations during measurement, such as capillary action in glass tube, temperature of electrolyte, and clamped boundary condition of specimen. Their effects in measurement were taken into account and compensated accordingly. When tested in Watts bath for nickel plating, the proposed design successfully recorded the evolution of internal stress with respect to plating thickness. Comparing with the results from commercial bent strip method and the literature, the proposed design was capable of measuring both tensile and compressive internal stresses during electroplating with good precision.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
Weil R (1971) The origins of stress in electrodeposits, review of the literature dealing with stress in electrodeposited metal. Plating 58:137–146
Stoney GG (1909) The tension of metallic films deposited by electrolysis. Proc R Soc Lond 82:172–175
Pureza JM, Lacerda MM, De Oliveira AL, Fragalli JF, Zanon RAS (2009) Enhancing accuracy to Stoney equation. Appl Surf Sci 255:6426–6428
Richardson G, Stein B (1997) Comparative study of three internal stress measurement methods. AESF electroforming symposium, San Diego
Popereka MY, Rabinovich SM, Susioparov AM (1972) Electrodeposited cylindrical iron-nickel films of supracritical thickness I. Method of determining internal macrostresses. Russ Phys J 15(2):183–187
Engelhaupt DE, Irlesberger KH (1991) Apparatus and method for monitoring stress as a coating is applied. United States Patent No. 4,986,130B2
Hearne SJ, Floro JA (2005) Mechanisms inducing compressive stress during electrodeposition of Ni. J Appl Phys 97:paper no. 014901
Yamamoto W, Akiyama K, Harada F, Tsuru Y Electrode cartridge and a system for measuring an internal stress for a film of plating. United States Patent No. 7682493 B2
MatWeb, http://www.matweb.com/search/DataSheet.aspx?MatGUID=d3bd4617903543ada92f4c101c2a20e5, Website visited Feb. 20, 2015
Timoshenko SP, Woinowsky-Krieger S (1959) Theory of plate and shells, International Edition. McGraw-Hill, Singapore
Hsu JC, Lin KL (2005) The effect of saccharin addition on the mechanical properties and fracture behavior of electroless Ni-Cu-P deposit on Al. Thin Solid Films 471:186–193
Nordström A, Gudmundson P, Carlsson LA (1998) Influence of sheet dimensions on curl of paper. J Pulp Pap Sci 24:18–25
Östlund M, Östlund S, Carlsson LA, Fellers C (2005) Experimental determination of residual stresses in paperboard. Exp Mech 45:493–497
Acknowledgments
The partial financial support from Ministry of Science and Technology, Taiwan, under Grant No. MOST 103 - 2221 - E - 027 – 019 is gratefully acknowledged.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Hong, JG., Lee, CY. Development of a Real-time Measurement Device for Monitoring the Internal Stress During Electroplating. Exp Tech 41, 51–57 (2017). https://doi.org/10.1007/s40799-016-0155-0
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s40799-016-0155-0