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Effect of Bonding Temperature on the Microstructures and Strengths of C/C Composite/GH3044 Alloy Joints by Partial Transient Liquid-Phase (PTLP) Bonding with Multiple Interlayers

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Acta Metallurgica Sinica (English Letters) Aims and scope

Abstract

With the use of Ti/Ni/Cu/Ni multiple foils as interlayer, carbon/carbon (C/C) composite was bonded to Ni-based superalloy GH3044 by partial transient liquid-phase bonding technique. The effect of bonding temperature on the microstructures and strengths of the joints was investigated. The results showed that gradient structural multiple interlayers composed of “C–Ti reaction layer/Ti–Ni intermetallic compound layer/Ni–Cu sosoloid/residual Cu layer/Ni-GH3044 diffusion layer” were formed between C/C composite and GH3044. The shear strength of the C/C composite/GH3044 joint reached the highest value of 26.1 MPa when the bonding temperature was 1,030 °C. In addition, the fracture morphology showed that the fracture mode changed with the increase of bonding temperature.

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Acknowledgments

This work was financially supported by the National Natural Science Foundation of China (Nos. 51202193 and 51221001), the Fundamental Research Foundation of Northwestern Polytechnical University (No. GBKY1021), and the “111” Project (No. 08040).

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Authors and Affiliations

  1. State Key Laboratory of Solidification Processing, C/C Composites Research Center, Northwestern Polytechnical University, Xi’an, 710072, Shaanxi, China

    Xin Zhang, Xiaohong Shi, Jie Wang, Hejun Li, Kezhi Li & Yancai Ren

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  1. Xin Zhang
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  2. Xiaohong Shi
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  3. Jie Wang
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  4. Hejun Li
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  5. Kezhi Li
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Correspondence to Xiaohong Shi.

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Zhang, X., Shi, X., Wang, J. et al. Effect of Bonding Temperature on the Microstructures and Strengths of C/C Composite/GH3044 Alloy Joints by Partial Transient Liquid-Phase (PTLP) Bonding with Multiple Interlayers. Acta Metall. Sin. (Engl. Lett.) 27, 663–669 (2014). https://doi.org/10.1007/s40195-014-0090-y

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  • DOI: https://doi.org/10.1007/s40195-014-0090-y

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