Abstract
This paper explored the effect of deposition conditions on the characteristics of copper oxide (CuOx) thin films prepared by direct current (DC) magnetron sputtering. X-ray diffraction exhibited that CuO with n-type conductivity was the main composition regardless of the DC magnetron sputtering power whereas the phase transition from n-type CuO to p-type Cu2O was observed with decreasing the oxygen pressure (OP) from 40 to 20%. The optical band gap ranges of 1.6–1.9 eV, which are characteristic of n-type CuO, were determined for samples prepared with OPs of 30–40% while the optical band gap of 2.3 eV, which is characteristic of p-type Cu2O, was measured for samples prepared with an OP of 20%. In addition, only Cu+ X-ray photoelectron spectroscopy (XPS) peak at the ~932.6 eV position exists in the films deposited with an OP of 20%, whereas only Cu2+ XPS peaks at ~934.2 eV and in the range of 940–945 eV are observed in the films deposited with an OP of 40%. Furthermore, as a result of XPS depth profile analysis, it was confirmed that the composition ratio of the sample prepared at an OP of 20% was Cu2O, whereas the composition ratio of the sample prepared at an OP of 40% was CuO. These suggest that the CuOx thin films could be constantly converted from n-type CuO to p-type Cu2O by decreasing the oxygen partial pressure. Thin film transistors with Cu2O deposited at 20% OP revealed p-type characteristics such as onset voltage (VON) of −3 V, saturated hole mobility of 8 cm2/Vs at VGS = −28 V, subthreshold swing of 0.86 V/decade at VGS–VON = −0.5 V, and on/off ratio of 1.14 × 103.
Similar content being viewed by others
References
S.F.U. Farhad, D. Cherns, J.A. Smith, N.A. Fox, D.J. Fermín, Mater. Des. 193, 108848 (2020)
D. Muñoz-Rojas, M. Jordan, C. Yeoh, A.T. Marin, A. Kursumovic et al., AIP Adv. 2, 042179 (2012)
A.H. Shukor, H.A. Alhattab, I. Takano, J. Vac. Sci. Technol. B 38, 012803 (2020)
T. Minami, H. Tanaka, T. Shimakawa, J. Miyata, H. Sato, Jpn. J. Appl. Phys. 43, 917 (2004)
H. Kim, S. Bae, D. Jeon, J. Ryu, Green Chem. 20, 3732 (2018)
A. Dey, G. Chandrabose, L.A.O. Damptey, E.S. Erakulan, R. Thapa et al., Appl. Surf. Sci. 541, 148571 (2021)
M. Nesa, M. Sharmin, A.H. Bhuiyan, Mater. Sci. Semicond. Process. 122, 105479 (2021)
X. Wang, X. Xu, J. Thermophys. Heat Tran. 13, 474 (1999)
S. Ishio, T. Narisawa, S. Takahashi, Y. Kamata, S. Shibata et al., J. Magn. Magn. Mater. 324, 295 (2012)
W. Peng, Y. Zhou, J. Li, Y. Liu, J. Zhang et al., Mater. Sci. Semicond. Process. 131, 105883 (2021)
E. Fortunato, P. Barquinha, R. Martins, Adv. Mater. 24, 2945 (2012)
L. Guo, M. Zhao, D. Zhuang, Q. Gong, H. Tan et al., Mater. Sci. Semicond. Process. 46, 35 (2016)
L. Qiang, W. Liu, Y. Pei, G. Wang, R. Yao, Solid State Electron. 129, 163 (2017)
R. Martins, A. Nathan, R. Barros, L. Pereira, P. Barquinha et al., Adv. Mater. 23, 4491 (2011)
C. Ju, C. Park, H. Yang, U. Kim, Y.M. Kim et al., Curr. Appl. Phys. 16, 300 (2016)
J.-H. Lee, Y.-J. Choi, C.-Y. Jeong, D.-K. Jung, S. Ham et al., IEEE Electron Dev. Lett. 37, 300 (2016)
A. Azmi, J. Lee, T.J. Gim, R. Choi, J.K. Jeong, IEEE Electron Dev. Lett. 38, 1543 (2017)
P.-C. Chen, Y.-C. Chiu, Z.-W. Zheng, C.-H. Cheng, Y.-H. Wu, J. Alloys Compd. 707, 162 (2017)
H. Luo, L. Liang, H. Cao, Solid State Electron. 129, 88 (2017)
J.S. Ahn, R. Pode, K.B. Lee, Thin Solid Films 608, 102 (2016)
T.J. Yen, A. Chin, V. Gritsenko, Nanomater. 11, 92 (2021)
L.S. Huang, S.G. Yang, T. Li, B.X. Gu, Y.W. Du et al., J. Cryst. Growth 260, 130 (2004)
A. Parretta, M.K. Jayaraj, A.D. Nocera, S. Loreti, L. Quercia et al., Phys. Status Solidi A 155, 399 (1996)
S. Ghosh, D.K. Avasthi, P. Shah, V. Ganesan, A. Gupta et al., Vacuum 57, 377 (2000)
C.A.N. Fernando, S.K. Wetthasinghe, Sol. Energy Mater. Sol. Cells 63, 299 (2000)
I.L. Yubinetsky, S. Thevulhasan, D.E. Mc Cready, D.R. Baer, J. Appl. Phys. 94, 7926 (2003)
C. Vitelaru, I. Pana, A.E. Kiss, N.C. Zoita, A. Vladescu et al., J. Optoelectron. Adv. Mater. 21, 717 (2019)
H. Siddiqui, M.R. Parra, M.S. Qureshi, M.M. Malik, F.Z. Haque, J. Mater. Sci. 53, 8826 (2018)
L. Wang, R. Zhang, T. Zhou, Z. Lou, J. Deng et al., Sens. Actuators B Chem. 239, 211 (2017)
W.-S. Chiang, J.-Q. Huang, K.-C. Tso, P.-S. Hung, P.-C. Chen et al., Thin Solid Films 660, 585 (2018)
B.D. Viezbicke, S. Patel, B.E. Davis, D.P. Birnie III., Phys. Status Solidi B 252, 1700 (2015)
J. Tauc, R. Grigorovici, A. Vancu, Phys. Status Solidi 15, 627 (1966)
E.A. Davis, N.F. Mott, Philos. Mag. 22, 903 (1970)
A. Moumen, B. Hartiti, E. Comini, Z. El khalidi, H.M.M.M. Arachchige et al., Superlattices Microstruct. 127, 2 (2019)
E.-J. Yun, J.W. Jung, Y.H. Han, M.-W. Kim, B.C. Lee, J. Korean Phys. Soc. 56, 356 (2010)
M. Nyborg, A. Azarov, K. Bergum, E. Monakhov, Thin Solid Films 722, 138573 (2021)
M. Ajili, N.T. Kamoun, Optik 229, 166222 (2021)
J.J.D. Leon, D.M. Fryauf, R.D. Cormia, M.-X.M. Zhang, K. Samuels et al., ACS Appl. Mater. Interfaces 8, 22337 (2016)
M. Debucquoy, S. Verlaak, S. Steudel, K. Myny, J. Genoe, P. Heremans, Appl. Phys. Lett. 91, 103508 (2007)
K.M. Yu, J.T. Yuh, S.H.K. Park, M.K. Ryu, E.J. Yun, B.S. Bae, Jpn. J. Appl. Phys. 52, 10MA12 (2013)
T. Kamiya, H. Hosono, NPG Asia Mater. 2, 15 (2010)
C.G. Lee, B. Cobb, A. Dodabalapur, Appl. Phys. Lett. 97, 203505 (2010)
Acknowledgements
This study was supported by the Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Education (NRF-2019R1D1A3A0310351513).
Author information
Authors and Affiliations
Corresponding author
Additional information
Publisher's Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
Springer Nature or its licensor holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.
About this article
Cite this article
Park, S.J., Yun, EJ. Preparation of sputter-deposited CuOx thin film with p-type conductivity and application as thin film transistor. J. Korean Phys. Soc. 81, 867–875 (2022). https://doi.org/10.1007/s40042-022-00596-7
Received:
Revised:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s40042-022-00596-7