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Numerical Investigations of Mini-Channel Heat Sink for Microprocessor Cooling: Effect of Slab Thickness

  • Research Article-Mechanical Engineering
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Abstract

High heat generation in microelectronics devices is an inevitable consequence of high processing loads. One of the important factors in design of electronic devices is to design a smart cooling system to remove the generated heat well in time for a reliable and longer life. Water-cooled heat sinks are replacing air-cooled heat sinks with the rapid compactness and high process requirements. In this work, we introduced a slab in mini-channel and evaluated the thermal performance of mini-channel heat sink. The boundary layer separately develops in upper and lower portions of channel, which enhanced the heat transfer. We changed the thickness of slab from 0.2 to 1.6 mm for fin spacing of 0.5 mm and 1 mm, respectively, to determine the effects of thickness on overall thermal performance of heat sink. The computed values were then compared with the data available in the literature without slab. The minimum base temperatures recorded for 0.2-mm-thick slab with fin spacing of 0.5 mm and 1.0 mm were 40.1 °C and 42.4 °C, respectively. This represents a reduction of 12.5% and 16.2%, respectively, in the base temperature as compared to the base temperature without a slab.

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Abbreviations

A :

Width of finned section (mm)

A sf :

Surface area of heat sink (m2)

A c :

Cross-sectional area of channel (m2)

α sf :

Surface area density (1/m)

B :

Un-finned length (mm)

c :

Fin spacing (mm)

c c :

Centre-to-centre distance between two consecutive channels (mm)

h :

Height of fin (mm)

h f :

Height from bottom to inlet/outlet face (mm)

l :

Length of fin (mm)

l b :

Square chip base length (mm)

ṁ :

Mass flow rate (kg/s)

P :

Perimeter of channel (m)

Pr:

Prandtl number

ΔP :

Pressure drop (Pa)

\( \dot{Q} \) :

Heat transfer rate (W)

q :

Heat flux (W/cm2)

R th :

Thermal resistance (°C/W)

Re:

Reynolds number

S t :

Slab thickness (mm)

T B :

Base temperature (°C)

t :

Thickness of fins (mm)

t b :

Thickness of heat sink base plate (mm)

t c :

Chip thickness (mm)

T i :

Fluid inlet temperature (°C)

T o :

Fluid outlet temperature (°C)

U in :

Inlet velocity (m/s)

U, v, w :

Velocity in x, y, z, respectively, (m/s)

α sf :

Surface area density (1/m)

µ t :

Turbulence viscosity (kg/ms)

µ :

Dynamic viscosity (kg/ms)

λ :

Thermal conductivity (W/m °C)

ρ :

Density of fluid (kg/m3)

CFD:

Computational fluid dynamics

LPM:

Litres per minute

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Author information

Authors and Affiliations

  1. Mechanical Engineering Department, Wah Engineering College, University of Wah, Wah Cantt, Pakistan

    Hussain Ahmed Tariq

  2. Department of Mechanical Engineering, Institute of Space Technology, Islamabad, Pakistan

    Hussain Ahmed Tariq & Muhammad Anwar

  3. Faculty of Science, University of Nottingham, Nottingham, NG7 2RD, UK

    Muhammad Anwar

  4. College of Earth and Environmental Sciences, University of the Punjab, Lahore, Pakistan

    Abdullah Malik

Authors
  1. Hussain Ahmed Tariq
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  2. Muhammad Anwar
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  3. Abdullah Malik
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Correspondence to Muhammad Anwar.

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Tariq, H.A., Anwar, M. & Malik, A. Numerical Investigations of Mini-Channel Heat Sink for Microprocessor Cooling: Effect of Slab Thickness. Arab J Sci Eng 45, 5169–5177 (2020). https://doi.org/10.1007/s13369-020-04370-4

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  • DOI: https://doi.org/10.1007/s13369-020-04370-4

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