Abstract
The effect of bimetallic monodisperse CoPd nanoparticles on the microstructure and the shear strength of the Cu/ SAC305/Cu solder joint was investigated. The nanocomposite Sn–3.0Ag–0.5Cu (SAC305) solders with 0.1, 0.3, 0.5, and 1.0 wt% nanoCoPd were prepared through a paste mixing method. The employed bimetallic nanoparticles were produced via a modified oleylamine method. The microstructural analysis of as-solidified Cu/solder/Cu joints was performed by scanning electron microscopy. The results showed that initial additions of CoPd nanoparticles into the SAC305 solder promoted the growth of the interfacial planar-type Cu3Sn IMC layer; while the average thickness of the interfacial scallop-type Cu6Sn5 IMC layer slightly decreased. Further additions of the nanosized CoPd admixtures to the SAC305 solder paste lead to a significant increase of the average thickness of the Cu6Sn5 intermetallic compound layer up to 40%. The shear strength measurements were performed to investigate a relationship between the microstructure and mechanical properties of the investigated solder joints. The results indicated a decrease in the shear strength of the SAC305 solder joint by addition of 0.1 wt% CoPd NPs, while a difference in absolute values between solder joints with 0.3, 0.5, and 1.0 wt% nanoCoPd was practically insignificant.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
Anderson IE, Cook BA, Harringa J, Terpstra RL (2002) Microstructural modifications and properties of Sn–Ag–Cu solder joints induced by alloying. J Electron Mater 31:1166–1174. https://doi.org/10.1007/s11664-002-0006-x
Baheti VA (2017) Diffusion-controlled growth of phases in metal−tinsystems related to microelectronics packaging. PhD Thesis, Department of Materials Engineering at the Indian Institute of Science. https://arxiv.org/ftp/arxiv/papers/1804/1804.09595.pdf, https://materials.iisc.ac.in/~praveenk/synopsis_varun.pdf
Chen G, Liu L, Silberschmidt VV, Liu CQ, Wu FS, Chan YC (2018) Microstructural evolution of 96.5Sn–3Ag–0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradient. J Mater Sci Mater Electron 29:5253–5263. https://doi.org/10.1007/s10854-017-8489-7
Hu X, Qiu Y, Jiang X, Li Y (2018) Effect of Cu6Sn5 nanoparticle on thermal behavior, mechanical properties and interfacial reaction of Sn3.0Ag0.5Cu solder alloys. J Mater Sci Mater Electron 29(18):15983–15993. https://doi.org/10.1007/s10854-018-9684-x
MedCalc Software (2019) Digimizer image analysis software. https://www.digimizer.com/features.php
Plevachuk Yu, Yakymovych A, Tkach O, Švec P Sr, Švec P, Orovcik L (2019) Nanocomposite SAC solders: the effect of adding un-coated and Au-coated carbon nanotubes on morphology of Cu/Sn–3.0Ag–0.5Cu/Cu solder joints. 2019 IEEE 2nd Ukraine Conference on Electrical and Computer Engineering (UKRCON) 722–725. https://doi.org/10.1109/ukrcon.2019.8879891
Sun L, Zhang L, Xu L, Zhong SJ, Ma J, Bao L (2016) Effect of nano-Al addition on properties and microstructure of low-Ag content Sn–1Ag–0.5Cu solders. J Mater Sci 27(7):7665–7673. https://doi.org/10.1007/s10854-016-4751-7
Tay SL, Haseeb ASMA, Johan MR (2013) Addition of cobalt nanoparticles into Sn–3.8Ag–0.7Cu lead-free solder by paste mixing. Solder Surf Mt Tech 23(1):10–14. https://doi.org/10.1108/09540911111099659
Yakymovych A, Plevachuk Yu, Sklyarchuk V, Sokoliuk B, Galya T, Ipser H (2017a) Microstructure and electro-physical properties of Sn–3.0Ag–0.5Cu nanocomposite solder reinforced with Ni nanoparticles in the melting-solidification temperature range. J Phase Equilib Diffus 38(3):217–222. https://doi.org/10.1007/s11669-017-0532-0
Yakymovych A, Plevachuk Yu, Švec P Sr, Janičkovič D, Šebo P, Beronská N, Nosko M, Orovcik L, Roshanghias A, Ipser H (2017b) Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles. J Mater Sci 28(15):10965–10973. https://doi.org/10.1007/s10854-017-6877-7
Yakymovych A, Sr Švec P, Orovcik L, Bajana O, Ipser H (2018) Nanocomposite SAC solders: the effect of adding Ni and Ni-Sn nanoparticles on morphology and mechanical properties of Sn–3.0Ag–0.5Cu solders. J Electron Mater 47(1):117–123. https://doi.org/10.1007/s11664-017-5834-9
Yakymovych A, Slabon A, Plevachuk Yu, Sklyarchuk V, Sokoliuk B (2019) Lightweight magnesium nanocomposites: electrical conductivity of liquid magnesium doped by CoPd nanoparticles. Appl Nanosci 9(5):1119–1125. https://doi.org/10.1007/s13204-018-0789-6
Acknowledgements
Financial support for this study came from the Austrian Science Fund (FWF) under Project Nos. P 26304 and P 27049, and the Slovak Scientific Grant Agency under Project Nos. VEGA 2/0172/16 and VEGA 2/0082/17. Adam Slabon would like to thank MISTRA (project: SafeChem) for financial support.
Author information
Authors and Affiliations
Corresponding authors
Ethics declarations
Conflict of interest
On behalf of all authors, the corresponding author states that there is no conflict of interest.
Rights and permissions
About this article
Cite this article
Yakymovych, A., Slabon, A., Švec, P. et al. Nanocomposite SAC solders: the effect of adding CoPd nanoparticles on the morphology and the shear strength of the Sn–3.0Ag–0.5Cu/Cu solder joints. Appl Nanosci 10, 4603–4607 (2020). https://doi.org/10.1007/s13204-020-01325-x
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s13204-020-01325-x