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Effects of Curing Temperature and Adhesion Promoters on Adhesion of Addition-cure Liquid Silicone Rubber

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Abstract

It is of great interest and challenge to improve the bond strength of addition-cure liquid silicone rubber (ALSR) as packaging material. The aim of this work is to evaluate the influence of the curing temperature and adhesion promoters on adhesion of ALSR. We investigate the effects of various adhesion promoters, namely, epoxy-containing silane (EP-PHMS), ester-containing silane (EH-PHMS), and urethane-containing silane (N-PHMS), on bond strength of ALSR. The obtained results demonstrate that at heat curing temperature, bond strength is mainly affected by the chemical reactions of functional groups. At this condition, EH-PHMS best enhances the strengths of bonds between ALSR and aluminum and between ALSR and polycarbonate (by 316 and 300%, respectively); however, the bonding between ALSR and glass is most improved by EP-PHMS (increased by 1107% ). At room curing temperature, N-PHMS yields the best bond properties for all three substrates. In addition, the mechanisms of adhesion promoters were studied by time-viscosity testing, surface tension testing and scanning electron microscopy (SEM). The results certified the mechanism was attributed to chemical reactions, intermolecular forces, and wetting properties. The data reported herein are of great significance for the fabrication of ALSR materials that can strongly bind to various types of substrates.

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Data Availability

All data generated or analysed during this study are included in this published article (and its supplementary information files).

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Acknowledgements

We thank LetPub (https://www.letpub.com) for its linguistic assistance during the preparation of this manuscript.

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Authors and Affiliations

  1. Key Lab for Fine Processing of Resources and Advanced Materials of Hunan Province, Hunan Normal University, Changsha, Hunan, 410081, China

    Chaohua Li, Bikui Wang, Longjing Zhou, Xi Hou & Shengpei Su

  2. Hunan Key Laboratory of Near-Space Meteo-Ballon Materials and Technology, Zhuzhou, Hunan, 412000, China

    Chaohua Li

  3. National and Local Joint Engineering Laboratory for New Petro-chemical Materials and Fine Utilization of Resources, Hunan Normal University, Changsha, Hunan, 410081, China

    Bikui Wang, Longjing Zhou, Xi Hou & Shengpei Su

Authors
  1. Chaohua Li
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  2. Bikui Wang
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  3. Longjing Zhou
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  4. Xi Hou
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  5. Shengpei Su
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Contributions

Chaohua Li performed the data analyses and wrote the manuscript; Shengpei Su contributed significantly to analysis and manuscript preparation; Bikui Wang performed the experiment; Longjing Zhou helped perform the analysis with constructive discussions; Xi Hou contributed to the conception of the study.

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Correspondence to Shengpei Su.

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The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

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I would like to declare on behalf of my co-authors that the work described is original research that has not been previously published and is not under consideration for publication elsewhere, in whole or in part. All of the authors listed have approved the manuscript that is enclosed.

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Highlights

• EP-PHMS, EH-PHMS, N-PHMS, were prepared by the hydrosilylation reaction. 

• The bond strength of ALSR was enhanced by adhesion promoters.

• Possible mechanism of adhesion promoters on bond behavior was proposed.

• Possible mechanism of curing temperature on the bond behavior was proposed.

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Li, C., Wang, B., Zhou, L. et al. Effects of Curing Temperature and Adhesion Promoters on Adhesion of Addition-cure Liquid Silicone Rubber. Silicon 14, 10495–10507 (2022). https://doi.org/10.1007/s12633-022-01748-x

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  • DOI: https://doi.org/10.1007/s12633-022-01748-x

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