Abstract
In this work Copper based composites were synthesized from Cu and SiC powders using Powder Metallurgy (PM) technique. The composition of the composites are Cu, Cu-5 wt% SiC, Cu-10 wt% SiC and Cu-15 wt% SiC were made using 400 kN hydraulic press and sintered at 900 °C using muffle furnace for 4 h. Scanning Electron Microscope (SEM) analysis was done on ball milled powders and sintered samples showed the uniform dispersal of SiC in the Cu. EDAX analysis evident the occurrence of SiC in the matrix. The addition of SiC in Cu improved the hardness and compressive strength (CS). Salt spray corrosion test resulted that, the improved corrosion resistance was obtained for the composite contain 10 wt.% of SiC. The corrosion rate was accomplished for the Cu – 10 wt.% SiC composite as 0.000894535 mm/year. Highest CS was attained for the sample contain 10 wt.% of SiC and highest hardness was observed for the sample contain 15 wt.% of SiC. The strengthening mechanism was discussed with the help of SEM images. The density was decreased and the % porosity was increased for the increasing wt.% of SiC in Cu matrix. The sintered density is higher than the green density for all the samples. From the observed results, it is concluded that produced composites would be suitable for radiator applications.
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The authors wish to thank the K.Ramakrishnan College of Engineering, Trichy Tamil Nadu, India for the support rendered to this work.
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Conceptualization: [M.Ravichandran] [M Meignanamoorthy].
Methodology: [M.Melwin Jagadeesh Sridhar] [M.Ravichandran].
Formal analysis and investigation: [M Meignanamoorthy].
Writing - original draft preparation: [M.Melwin Jagadeesh Sridhar] [M.Ravichandran];
Writing - review and editing: [M.Melwin Jagadeesh Sridhar] [M.Ravichandran] [M Meignanamoorthy] [V.Mohanavel].
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Sridhar, M.M.J., Ravichandran, M., Meignanamoorthy, M. et al. Effect of Silicon Carbide on Microstructural, Mechanical and Corrosion Behavior of Electrolytic Copper Matrix Composite Produced by the Powder Metallurgy Route. Silicon 14, 5877–5886 (2022). https://doi.org/10.1007/s12633-021-01369-w
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DOI: https://doi.org/10.1007/s12633-021-01369-w