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Evaluation and optimization of heat transfer at the interfaces of spacecraft assemblies

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Abstract

This paper presents the experimental and numerical work achieved in the aim of evaluating the heat transfer at the interfaces of threaded spacecraft assemblies, where Thermal Interface Materials (TIMs) are placed between two surfaces to improve the thermal performance. Developing a model to predict thermal resistance for such an assembly is a serious challenge, which has to take various influencing parameters into account. First, mechanical and thermal experiments used to characterise TIMs are summarised. Second, a numerical model capable of representing the behaviour of these materials is built. To verify the mechanical model, the preload of a single fastener assembly is measured and compared with a simulation. The thermo-mechanical model is verified by an assembly heated by a power resistor to evaluate the thermal aspects. The proposed material model is able to predict the loss of preload caused by creep/relaxation of the TIM and the temperature distribution of the assembly. This work is part of a broader study that seeks to develop a multi-physics approach to evaluate the heat transfer at interfaces of space application assemblies.

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References

  1. Yovanovich, M.M.: Four decades of research on thermal contact, gap, and joint resistance in microelectronics. IEEE Trans. Compon. Packag. Technol. 28(2), 182–206 (2005). https://doi.org/10.1109/TCAPT.2005.848483

    Article  Google Scholar 

  2. Sridhar, M.R., Yovanovich, M.M.: Elastoplastic contact conductance model for isotropic conforming rough surfaces and comparison with experiments. J. Heat Transf. 118(1), 3–9 (1996). https://doi.org/10.1115/1.2824065

    Article  Google Scholar 

  3. Savija, I., Culham, J.R., Yovanovich, M.M., Marotta, E.E.: Review of thermal conductance models for joints incorporating enhancement materials. J Thermophys Heat Transf 17(1), 43–52 (2003). https://doi.org/10.2514/2.6732

    Article  Google Scholar 

  4. Vogd, C., Fletcher, L.S., Peterson, G.P.: The interfacial pressure distribution and thermal conductance of bolted joints. J Heat Transf 116, 823–828 (1994). https://doi.org/10.1115/1.2911454

    Article  Google Scholar 

  5. Min, S., Blumm, J., Lindemann, A.: A new laser flash system for measurement of the thermophysical properties. Thermochim. Acta. 455(1), 46–49 (2007). https://doi.org/10.1016/j.tca.2006.11.026

    Article  Google Scholar 

  6. ASTM International: ASTM D5470-12, standard test method for thermal transmission properties of thermally conductive electrical insulation materials. West Conshohocken, PA, pp. 1-6 (2012). https://doi.org/10.1520/D5470-12

  7. Lee, Y.J.: Thermo-mechanical properties of high performance thermal interface gap filler pads. IEEE Intersoc Conf Therm Thermomech Phenom Electron Syst. 12, 1–8 (2010). https://doi.org/10.1109/ITHERM.2010.5501306

    Google Scholar 

  8. Sponagle, B., Groulx, D.: Characterization of thermal interface materials using a steady state experimental method. In: Proceedings of the ASME 2012 summer heat transfer conference, HT2012-58262. Rio Grande, Puerto Rico, 8–12 July 2012, pp. 641–648 (2012). https://doi.org/10.1115/HT2012-58262

  9. Savija, I., Culham, J.R., Yovanovich, M.M.: Effective thermophysical properties of thermal interface materials: part I—definitions and models. In: ASME 2003 International Electronic Packaging Technical Conference and Exhibition, pp. 189–200 (2003). https://doi.org/10.1115/IPACK2003-35088

  10. ASTM International: ASTM F38-00(2014), Standard test methods for creep relaxation of a gasket material. West Conshohocken, PA, pp. 1–9 (2014

  11. Kobayashi, T., Hamano, K.: The reduction of bolt load in bolted flange joints due to gasket creep-relaxation characteristics. In: ASME/JSME 2004 pressure vessels and piping conference. ASME, San Diego, July 25–29, pp. 97–104 (2004). https://doi.org/10.1115/PVP2004-2627

    Google Scholar 

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Acknowledgements

This research work is supported by CNES (the French Space Agency) and Thales Alenia Space.

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Authors and Affiliations

  1. CNES (French Space Agency), 18 Avenue Edouard Belin, 31401, Toulouse, France

    Simon Vandevelde

  2. Université de Toulouse, Institut Clément Ader, UMR CNRS 5312, INSA/UPS/ISAE/Mines Albi, 3 rue Caroline Aigle, 31400, Toulouse, France

    Simon Vandevelde, Alain Daidié & Marc Sartor

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  1. Simon Vandevelde
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  2. Alain Daidié
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  3. Marc Sartor
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Correspondence to Alain Daidié.

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Vandevelde, S., Daidié, A. & Sartor, M. Evaluation and optimization of heat transfer at the interfaces of spacecraft assemblies. CEAS Space J 11, 185–191 (2019). https://doi.org/10.1007/s12567-018-0226-4

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  • DOI: https://doi.org/10.1007/s12567-018-0226-4

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