Abstract
As electronic devices have become smaller, the importance of heat dissipation has grown. Therefore, to contribute to heat emission reduction efforts, we investigated the thermal diffusivity of Ag/CNT added to Ag matrix and compared it to that of pure Ag. The composite consisted of 99 wt% Ag and 1 wt% Ag/CNT. All samples, including the pure Ag sample, were densified via 10-min spark plasma sintering at 600 °C and 100 MPa. The morphological analysis of the samples was performed using SEM and TEM and their microstructure was derived through XRD. Two different thermal diffusivities were determined via the laser flash method. The remarkable increase in thermal diffusivity, even with the addition of as little as 1% of Ag/CNT, clearly shows that this is a feasible solution to the problem of heat dissipation in electronic devices.
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Abbreviations
- a:
-
Directional orientation of the system
- h:
-
Strip thickness
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Acknowledgements
This research was supported by the Basic Science Research Program through the National Research Foundation of Korea (NRF), funded by the Ministry of Education (NRF-2017R1A6A3A11030900 and NRF-2019R1A6A1A11055660). This study has been conducted with the support of the Korea Institute of Industrial Technology (KITECH) as “Development of aluminum micro heater design and fabrication technology with uniform temperature distribution through optimization design (kitech-IR-190069)”.
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Kim, S., Park, S., Kim, D. et al. Thermal Diffusivity of Ag/CNT-Added Ag Nanocomposites Prepared by Spark Plasma Sintering. Int. J. Precis. Eng. Manuf. 21, 1357–1362 (2020). https://doi.org/10.1007/s12541-020-00334-8
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DOI: https://doi.org/10.1007/s12541-020-00334-8