Abstract
This study attempted to manufacture Cu-Ga coating materials via the kinetic spray process and examined the effect of powder alloy composition on the microstructure and properties of the kinetic sprayed Cu-Ga based coating materials. Cu-15 at%Ga, Cu-20 at%Ga, and Cu-30 at%Ga powders were prepared and used. Annealing heat treatments were conducted at 200 °C~800 °C. The results showed that the coating layers could be manufactured with Cu-15 at%Ga and Cu-20 at%Ga powders via the kinetic spray process, except for Cu- 30 at%Ga. A single phase of pure Cu was observed in the Cu-15 at%Ga coating layer and Cu and Cu3Ga phases in the Cu-20 at%Ga coating layer. A small amount of Ga2O3 was also detected between deposited particles in both coating layers. It was difficult to obtain the coating layer due to the shattering of powders during the kinetic spraying with Cu-30 at%Ga powder, which is made up of a variety of inter-metallic compounds. Porosity and hardness decreased as the annealing temperature increased, and porosity decreased into 0.48% (Cu-15 at%Ga), 0.74%(Cu-20 at%Ga) at 800 °C. Annealing heat treatment appeared to be effective in enhancing the density of the coating layers without generating a new phase. This study also considered to suggest the optimal alloy composition of kinetic sprayed Cu-Ga based coating material for sputtering target.
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References
M. Kaelin, D. Rudmann, F. Kurdesau, T. Meyer, H. Zogg, and A. N. Tiwari, Thin Solid Films 431, 58 (2003).
M. Nouiri, Z. B. Ayadi, K. Khirouni, S. Alaya, K. Djessas, and S. Yapi, Mater. Sci. Eng. C 27, 1002 (2007).
K. Sakurai, R. Hunger, N. Tsuchimochi, T. Baba, K. Matsubara, P. Fons, A. Yamada, T. Kojima, T. Deguchi, H. Nadanishi, and S. Niki, Thin Solid Films 431, 6 (2003).
T. Nakano, T. Suzuki, N. Ohnuki, and S. Baba, Thin Solid Films 334, 192 (1998).
J. W. Lim, J. W. Bae, Y. F. Zhu, S. Lee, K. Mimura, and M. Isshiki, Surf. Coat. Tech. 201, 1899 (2006).
J. Sarkar, P. McDonald, and P. Gilman, Thin Solid Films 517, 1970 (2009).
H. Y. Hyun, M. J. Kim, J. H. Yoo, J. M. Yang, I. H. Oh, S. M. Lee and Y. J. Oh, Kor. J. Met. Mater. 49, 250 (2010).
G. Bertrand, S. Deleonibus, B. Previtali, G. Guegan, X. Jehl, M. Sanquer, and F. Balestra, Solid-State Electron 48, 505 (2004).
M. Moriyama, T. Morita, S. Tsukimoto, M. Shimada, and M. Murakami, Mater. Trans. 46, 1036 (2005).
K. J. Kardokus, C. T. Wu, Parfeniuk, L Chrstopher, and E. B. Jane, U.S. Patent 6, 645, 427. Nov. 11 (2003).
C. F. Lo, P. Mcdonald, D. Draper, and P. Gilman, J. Electron. Mater. 34, 1468 (2005).
H. Thomasv and V. Steenkiste, Key Eng. Mat. 197, 59 (2001).
J. H. Cho, Y. M. Jin, D. Y. Park, H. J. Kim, I. H. Oh, and K. A. Lee, Met. Mater. Int. 17, 157 (2011).
Y. M. Jin, J. H. Cho, D. Y. Park, J. H. Kim, and K. A. Lee, J. Therm. Spray Techn. 20, 497 (2011).
Y. M. Jin, M. G. Jeon, D. Y. Park, H. J. Kim, I. H. Oh, and K. A. Lee, J. Korean Powder Metall. Inst. 20, 245 (2013).
T. Stoltenhoff, C. Borchers, F. Grtner, and H. Kreye, Surf. Coat. Tech. 200, 4947 (2006).
W. L. Li, C. J. Li, and H. L. Liao, J. Therm. Spray Techn. 15, 1059 (2006).
S. J. Hong and C. Suryanarayana, J. Appl. Phys. 96, 6120 (2004).
W. Wang, D. J. Lee, H. J. Jeong, S. Lee, and H. S. Kim, Met. Mater. Int. 21, 7 (2015).
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Choi, BC., Park, DY. & Lee, KA. Effect of powder alloy composition on the microstructure and properties of kinetic sprayed Cu-Ga based coating materials. Met. Mater. Int. 22, 649–657 (2016). https://doi.org/10.1007/s12540-016-6094-6
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DOI: https://doi.org/10.1007/s12540-016-6094-6