Skip to main content
SpringerLink
Log in

Thermal modelling and design of dynamically-controlled heater plates for high temperature processing of 300 mm wafers

  • Published:
Journal of Mechanical Science and Technology Aims and scope Submit manuscript

Abstract

The temperature uniformity of heater plates (HPs) should be sustained due to critical dimension uniformity and robust operation in high temperature processing of 300 mm wafers. It is very challenging to maintain the temperature uniformity of the HP despite the dynamic control of power inputs and temperatures. The packaged power terminals (PPTs) of the HPs may considerably affect their thermal reliability. Hence, the sophisticated thermal modellings and designs of the HPs and the PPTs are necessary. In this study, the finite element analysis (FEA) thermal models of the HP and the PPT were generated, experimentally validated, and employed for the analysis and the design. The influences of the heating element width, the heating element gap, and the zone gap on the thermal performance of the HP were investigated. The parametric influences of the substrate thickness on the thermal performance of the PPT were also explored. The results show that the effect of the heating element width on the temperature of the HP is almost negligible. The results have found that a sophisticated design of the heating elements may reduce the radial temperature difference of the HP by 56 % compared with the baseline case. The results suggest that the sophisticated design may enable both the simplified structure and the enhanced temperature uniformity of the HP.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. J. Lee, H. G. Kwon, S. Shin, S. Han, J. Ha, H. Yoo and H. H. Cho, Thermal design of hot plate for 300-mm wafer heating in post-exposure bake, Microelectronic Engineering, 88 (2011) 3195–3198.

    Article  Google Scholar 

  2. H. T. Chua, A. Tay, Y. Wang and X. Wu, A heater plate assisted bake/chill system for photoresist processing in photolithography, Applied Thermal Engineering, 29 (2009) 985–997.

    Article  Google Scholar 

  3. T.-K. Lim and S.-H. Rhi, Experimental study on nanofludic heat pipe hot chuck plate in semiconductor wafer baking process, Journal of Mechanical Science and Technology, 24 (7) (2010) 1501–1509.

    Article  Google Scholar 

  4. Q. Zhang, K. Poolla and C. J. Spanos, Across wafer critical dimension uniformity enhancement through lithography and etch process sequence: Concept, approach, modeling, and experiment, IEEE Transactions on Semiconductor Manufacturing, 20(4) (2007) 488–505.

    Article  Google Scholar 

  5. W. K. Ho, A. Tay and C. D. Schaper, Optimal predictive control with constraints for the processing of semiconductor wafers on bake plates, IEEE Transactions on Semiconductor Manufacturing, 13(1) (2000) 88–96.

    Article  Google Scholar 

  6. K. V. Ling, W.K. Ho, B. F. Wu, A. Lo and H. Yan, Multiplexed MPC for multizone thermal processing in semiconductor manufacturing, IEEE Transactions on Control Systems Technology, 18(6) (2010) 1371–1380.

    Article  Google Scholar 

  7. A. Tay, H. T. Chua, W. Yuheng, Y. Geng and H. W. Khuen, Modeling and real-time control of multizone thermal processing system for photoresist processing, Industrial and Engineering Chemistry Research, 52 (2013) 4805–4814.

    Article  Google Scholar 

  8. E.-A. Khalid, C. D. Schaper and T. Kailath, Integrated bake/chill for photoresist processing, IEEE Transactions on Semiconductor Manufacturing, 12(2) (1999) 264–266.

    Article  Google Scholar 

  9. E.-A. Khalid, C. D. Schaper and T. Kailath, Control of spatial and transient temperature trajectories for photoresist processing, Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena, 17(5) (1999) 2109–2114.

    Article  Google Scholar 

  10. Q. Zhang, P. Friedberg, K. Poolla and C. Spanos, Enhanced spatial PEB uniformity through a novel bake plate design, 17th Advanced Equipment Control/Advanced Process Control Symposium, Indian Wells, CA (2005).

    Google Scholar 

  11. E.-A. Khalid, C. D. Schaper and T. Kailath, Programmable thermal processing module for semiconductor substrates, IEEE Transactions on Control Systems Technology, 12(4) (2004) 493–509.

    Article  Google Scholar 

  12. A. Tay, W.-K. Ho, A.-P. Loh, K.-W. Lim, W.-W. Tan and C. D. Schaper, Integrated bake/chill module with in situ temperature measurement for photoresist processing, IEEE Transactions on Semiconductor Manufacturing, 17(2) (2004) 231–242.

    Article  Google Scholar 

  13. ANSYS Inc., ANSYS Multiphysics User’S Guide, Canonsburg, PA. (2017).

  14. M. N. Ozisik, Heat Conduction, John Wiley and Sons Inc., New York (1993).

    Google Scholar 

  15. W. M. Haynes, D. R. Lide and T. J. Bruno, CRC Handbook of Chemistry and Physics, 97th Ed., CRC Press, New York (2017).

    Google Scholar 

Download references

Acknowledgments

This work was supported by the Industrial Technology Innovation Program (Project No: 10050980, System Reliability Improvement and Validation for New Growth Power Industry Equipment) funded by the Ministry of Trade, Industry & Energy (MI, Korea) and also supported by “Human Resources Program in Energy Technology” of KETEP, granted financial resource from the Ministry of Trade, Industry & Energy, Korea (No. 20164010200940).

Author information

Authors and Affiliations

  1. Dept. of Mechanical Design Eng., Pukyong National University, Busan, Korea

    Dae Seong Woo & Kyoung Joon Kim

  2. Dept. of Mechanical Eng., SUNY Korea, Incheon, Korea

    Changwoon Han

  3. Dept. of Mechanical & Aerospace Eng., Seoul National University, Seoul, Korea

    Byeng Dong Youn

Authors
  1. Dae Seong Woo
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Changwoon Han
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Byeng Dong Youn
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Kyoung Joon Kim
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Kyoung Joon Kim.

Additional information

Recommended by Associate Editor Jaeseon Lee

Dae Seong Woo received the master’s degree in mechanical design engineering from Pukyong National University, Busan, Korea in 2018. His major is heat transfer, and the main research work was multiphysics thermal design of microelectronics. He is researching on the AWHP (Air to Water Heat Pump) with LG Electronics as a Research Engineer from 2018 to the present.

Changwoon Han received the B.Sc. and M.Sc. degrees in mechanical engineering from Seoul National University, Seoul, Republic of Korea in 1993 and 1995 respectively, and a Ph.D. degree in mechanical engineering from the University of Maryland, College Park, MD, USA in 2005. He was a Principal Research Engineer of the Korea Electronics Technology Institute in Seongnam, Republic of Korea, from 2005 to 2017. He is currently an Associate Professor in Mechanical Engineering Department of the State University of New York, Korea in Incheon, Republic of Korea. His research interests include physics-of-failure, prognostics and health management, design-for-reliability, and photomechanics.

Byeng D. Youn received the B.S. degree from Inha University, Incheon, South Korea, in 1996, the M.S. degree from KAIST, Daejeon, Republic of Korea, in 1998, and the Ph.D. degree from the University of Iowa, Iowa City, IA, USA, in 2001. He is a Full Professor with the Department of Mechanical and Aerospace Engineering, Seoul National University (SNU), Seoul, South Korea, the CEO and Founder with OnePredict Inc., and the President of the Korean Society of Prognostics and Health Management (KSPHM). Before joining SNU, he was an Assistant Professor in the Department of Mechanical Engineering, University of Maryland, College Park. His research goal is to develop rational reliability and design methods based on mathematics, physics, and statistics for use in complex engineered systems, mainly focused on energy systems. His current research includes reliability-based design, prognostics and health management (PHM), energy harvester design, and virtual product testing. Dr. Youn’s dedication and efforts in research have garnered substantive peer recognition resulting in four notable awards including the ASME IDETC Best Paper Awards (2001 and 2008), the ISSMO/Springer Prize for a Young Scientist (2005), the IEEE PHM Competition Winner (2014), the Prime Minister’s Award (2019), etc.

Kyoung Joon Kim received the B.S. degree in mechanical engineering from Chung-Ang University, Seoul, Korea in 1999, the M.S. degree in mechanical engineering from the University of Minnesota, Minneapolis, MN, USA in 2002, and the Ph.D. degree in mechanical engineering from the University of Maryland, College Park, USA in 2006. He had been with Bell Laboratories, Dublin, Ireland, as a Member of Technical Staff from 2008 to 2010. He is currently an Associate Professor in Mechanical Design Engineering, Pukyong National University, Busan, Korea. His current research interests are thermal management of electronics and photonics, conjugate heat transfer with advanced extended surfaces, and multiphysics thermal design for microelectronics reliability.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Woo, D.S., Han, C., Youn, B.D. et al. Thermal modelling and design of dynamically-controlled heater plates for high temperature processing of 300 mm wafers. J Mech Sci Technol 33, 5009–5016 (2019). https://doi.org/10.1007/s12206-019-0939-0

Download citation

  • Received:

  • Revised:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s12206-019-0939-0

Keywords

Search

Navigation