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A design approach of bonding head guiding platform for die to wafer hybrid bonding application using compliant mechanism

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Abstract

In semiconductor manufacturing process, the wafer direct bonding, so-called die-to-wafer hybrid bonding, still has unexpected voids on the boning surface which decreases the bonding efficiency. Therefore, this paper proposes a design approach for the bonding head guiding platform (BHGP) based on compliant mechanism for the die-to-wafer hybrid bonding. Firstly, a bridge amplification module (BAM) is designed and simulated. Secondly, a dual parallelogram module (DPM) is designed and analyzed. Then, the BAM is combined with the DPM to create a full design of the BHGP. To investigate the parametric effect of the geometric inputs on the output behaviors of the platform, the parameter sensitivity is conducted. The multi-objective optimization study is performed using multi-objective genetic algorithm. The results determined the displacement can gain up to 191.88 μm, the parasitic error has a small value of 1.47 μm, and the von Mises stress is minimal value of 52 MPa. The crosstalk of the platform is about 3.82%, and this ratio ensures a linear characteristic of the platform. A small value of stress allows a high safety factor during operation. The result of this study is expected be utilized for removing voids in the die-to-wafer hybrid bonding process.

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Acknowledgements

This research is supported by Industrial University of Ho Chi Minh City (IUH) under grant number 01/HD-DHCN.

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Authors and Affiliations

  1. Faculty of Mechanical Engineering, Industrial University of Ho Chi Minh City, Ho Chi Minh City, Vietnam

    Duc Nam Nguyen

  2. Faculty of Mechanical Engineering, Ho Chi Minh City University of Technology and Education, Ho Chi Minh City, Vietnam

    Minh Phung Dang

  3. Division of Research & Innovation, Uttaranchal University, Uttarakhand, 248007, Dehradun, India

    Saurav Dixit

  4. Division of Computational Mechatronics, Institute for Computational Science, Ton Duc Thang University, Ho Chi Minh City, Vietnam

    Thanh-Phong Dao

  5. Faculty of Electrical & Electronics Engineering, Ton Duc Thang University, Ho Chi Minh City, Vietnam

    Thanh-Phong Dao

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  1. Duc Nam Nguyen
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  2. Minh Phung Dang
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  4. Thanh-Phong Dao
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Correspondence to Thanh-Phong Dao.

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Nguyen, D.N., Dang, M.P., Dixit, S. et al. A design approach of bonding head guiding platform for die to wafer hybrid bonding application using compliant mechanism. Int J Interact Des Manuf 17, 2855–2866 (2023). https://doi.org/10.1007/s12008-022-01019-4

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  • DOI: https://doi.org/10.1007/s12008-022-01019-4

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