Abstract
The present study reports a process route to recover copper values from two different discarded printed circuit boards. The boards are shredded and subjected to both air and water fluidization for the separation of plastic values. Tap density measurements are used to delineate the separation efficiency, and metal recovery is calculated using Newton efficiency. Thermal exposure of the underflow of water fluidization at 750°C yielded a copper-enriched concentrate with a purity of 73% copper with 11% Sn and 6% Pb and ~ 90% purity with 89% recovery for PCB-1 and PCB-2, respectively. It is concluded that a copper tin–lead mixed concentrate can be recovered from PCB-1, while almost pure copper can be recovered from PCB-2. The processing route followed is environment-friendly and cost-effective for the recovery of metallic values.
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R. Cayumil, R. Khanna, R. Rajarao, P.S. Mukherjee, and V. Sahajwalla, Waste Manag 57, 121 (2016).
R.K. Nekouei, F. Pahlevani, R. Rajarao, R. Golmohammadzadeh, and V. Sahajwalla, Mater. Des. 141, 26 (2018).
G. Zhang, H. Wang, J. Yang, Y. He, and T. Zhang, J. Clean. Prod. 187, 1036 (2018).
K. Ulman, S. Maroufi, S. Bhattacharyya, and V. Sahajwalla, J. Clean. Prod. 198, 1485 (2018).
R.G. Charles, P. Douglas, I.L. Hallin, I. Matthews, and G. Liversage, Waste Manag 60, 505 (2017).
A. Shokri, F. Pahlevani, I. Cole, and V. Sahajwalla, J. Environ. Manage. 199, 7 (2017).
R. Hossain, R.K. Nekouei, I. Mansuri, V. Sahajwalla, and A.C.S. Sustain, Chem. Eng. 7, 1006 (2019).
R. Cayumil, R. Khanna, M. Ikram-Ul-Haq, R. Rajarao, A. Hill, and V. Sahajwalla, Waste Manag 34, 1783 (2014).
A. Shokri, F. Pahlevani, K. Levick, I. Cole, and V. Sahajwalla, J. Clean. Prod. 142, 2586 (2017).
S. Maroufi, M. Mayyas, R.K. Nekouei, M. Assefi, V. Sahajwalla, and A.C.S. Sustain, Chem. Eng. 6, 3765 (2018).
V. Sahajwalla, R. Cayumil, R. Khanna, M. Ikram-Ul-Haq, R. Rajarao, P.S. Mukherjee, and A. Hill, J. Sustain. Metall. 1, 75 (2015).
L.A. Castro and A.H. Martins, Braz. J. Chem. Eng. 26, 649 (2009).
H. Lee and B. Mishra, Miner. Eng. 123, 1 (2018).
A. Das, A. Vidyadhar, and S.P. Mehrotra, Resour. Conserv. Recycl. 53, 464 (2009).
C. Eswaraiah, T. Kavitha, S. Vidyasagar, and S.S. Narayanan, Chem. Eng. Process. Process Intensif. 47, 565 (2008).
Y. Han, W. He, L. Li, G. Li, and J. Huang, Powder Technol. 295, 142 (2016).
Q. Guo, X. Yue, M. Wang, and Y. Liu, Powder Technol. 198, 422 (2010).
H. Wang, G. Zhang, J. Hao, Y. He, T. Zhang, and X. Yang, J. Clean. Prod. 170, 1501 (2018).
G. Zhang, Y. He, Y. Feng, T. Zhang, H. Wang, and X. Zhu, Sep. Purif. Technol. 207, 321 (2018).
C. Duan, X. Wen, C. Shi, Y. Zhao, B. Wen, and Y. He, J. Hazard. Mater. 166, 478 (2009).
Y.J. Park and D.J. Fray, J. Hazard. Mater. 164, 1152 (2009).
C. Guo, H. Wang, W. Liang, J. Fu, and X. Yi, Waste Manag 31, 2161 (2011).
A. Barnwal, S. Vishvakarma, and N. Dhawan, Mater. Today Proc. 5, 17046 (2018).
H.M. Veit, C.C. de Pereira, and A.M. Bernardes, JOM 54, 45 (2002).
R.K. Nekouei, F. Pahlevani, R. Rajarao, R. Golmohammadzadeh, and V. Sahajwalla, J. Clean. Prod. 184, 1113 (2018).
K. Ulman, A. Ghose, S. Maroufi, I. Mansuri, and V. Sahajwalla, Waste Manag 81, 138 (2018).
R. Cayumil, M. Ikram-Ul-Haq, R. Khanna, R. Saini, P.S. Mukherjee, B.K. Mishra, and V. Sahajwalla, Waste Manag 73, 556 (2018).
A. Barnwal and N. Dhawan, J. Sustain. Metall. 5, 519 (2019).
P.P.M. Ribeiro, I.D. Dos Santos, and A.J.B. Dutra, J. Mater. Res. Technol. 8, 513 (2019).
T. Hirajima, A. Bissombolo, K. Sasaki, K. Nakayama, H. Hirai, and M. Tsunekawa, Int. J. Miner. Process. 77, 240 (2005).
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The authors gratefully acknowledge the funding from the Faculty Initiation Grant received from the Indian Institute of Technology, Roorkee, India.
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Barnwal, A., Dhawan, N. Investigation of Discarded Printed Circuit Boards for Recovery of Copper Values. JOM 72, 2983–2992 (2020). https://doi.org/10.1007/s11837-020-04113-8
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DOI: https://doi.org/10.1007/s11837-020-04113-8