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Correlation of Plasma Erosion Resistance and the Microstructure of YF3 Coatings Prepared by Vacuum Kinetic Spray

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Abstract

To decrease the generation of contamination particles during semiconductor manufacturing processes, a plasma-erosion-resistant coating that can prevent particle dropout on the surface of the wafer etching chamber is required. In this work, correlation between plasma-erosion resistance and the microstructure of a YF3 coating deposited by vacuum kinetic spray (VKS) was studied. The plasma-erosion resistance of the coatings was evaluated using inductively coupled plasma etching tests, and the microstructure of the coatings before and after the etching test was analyzed using field emission scanning electron microscope and transmission electron microscope. Via a simple heat treatment of the feedstock powder, YF3 coatings with different deposition behaviors were prepared. As the heat treatment temperature of the feedstock powder was increased, the plasma-erosion resistance was improved. High-density YF3 coatings had randomly oriented small crystallites induced by sufficient room-temperature impact consolidation. The adhesion strength of the coating was improved with higher heat treatment temperature, which contributed to significant reduction in particle dropout from the YF3 coating. These results imply that the plasma-erosion resistance of YF3 coatings formed by VKS can be controlled by coating characteristics such as crystallite size, porosity, roughness, and density.

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References

  1. H. Abe, M. Yoneda, and N. Fujiwara, Developments of Plasma Etching Technology for Fabricating Semiconductor Devices, Jpn. J. Appl. Phys., 2008, 47(3R), p 1435

    Article  CAS  Google Scholar 

  2. J.C. Dehoog, M.J. Van Bergen, and M.H. Jacobs, Vapour-Phase Crystallization of Silica from SiF4-Bearing Volcanic Gases, Ann. Geophys. Italy, 2005, 48(4-5), p 775-785

    Google Scholar 

  3. N. Ito, T. Moriya, F. Uesugi, M. Matsumoto, S. Liu, and Y. Kitayama, Reduction of Particle Contamination in Plasma-Etching Equipment by Dehydration of Chamber Wall, Jpn. J. Appl. Phys., 2008, 47(5R), p 3630

    Article  CAS  Google Scholar 

  4. D.M. Kim, M.R. Jang, Y.S. Oh, S.M. Lee, and S.H. Lee, Relative Sputtering Rates of Oxides and Fluorides of Aluminum and Yttrium, Surf. Coat. Tech., 2017, 309, p 694-697

    Article  CAS  Google Scholar 

  5. J.B. Song, J.T. Kim, S.G. Oh, and J.Y. Yun, Contamination Particles and Plasma Etching Behavior of Atmospheric Plasma Sprayed Y2O3 and YF3 Coatings under NF3 Plasma, Coatings, 2019, 9(2), p 102

    Article  Google Scholar 

  6. D.M. Kim, S.M. Lee, S.W. Kim, H.T. Kim, and Y.S. Oh, Microstructural Changes of the Al2O3 Ceramics during the Exposure to Fluorine Plasma, J. Korean Ceram. Soc., 2008, 45(7), p 405-410

    Article  CAS  Google Scholar 

  7. M. Kodo, K. Soga, H. Yoshida, and T. Yamamoto, Low Temperature Sintering of Polycrystalline Yttria by Transition Metal Ion Doping, J. Ceram. Soc. Jpn., 2009, 117(1366), p 765-768

    Article  CAS  Google Scholar 

  8. T.K. Lin, W.K. Wang, S.Y. Huang, C.T. Tasi, and D.S. Wuu, Comparison of Erosion Behavior and Particle Contamination in Mass-Production CF4/O2 Plasma Chambers using Y2O3 and YF3 Protective Coatings, Nanomaterials, 2017, 7(7), p 183

    Article  Google Scholar 

  9. J. Kitamura, H. Ibe, F. Yuasa, and H. Mizuno, Plasma Sprayed Coatings of High-Purity Ceramics for Semiconductor and Flat-Panel-Display Production Equipment, J. Therm. Spray Technol., 2008, 17(5), p 878-886

    Article  CAS  Google Scholar 

  10. T.K. Lin, D.S. Wuu, S.Y. Huang, and W.K. Wang, Characteristics of Yttrium Fluoride an Yttrium Oxide Coatings for Plasma Process Equipment Prepared by Atmospheric Plasma Spraying, Jpn. J. Appl. Phys., 2016, 55, p 126201

    Article  Google Scholar 

  11. J. Kitamura, H. Mizuno, N. Kato, and I. Aoki, Plasma-Erosion Properties of Ceramic Coating Prepared by Plasma Spraying, Mater., 2006, 47(7), p 1677-1683

    CAS  Google Scholar 

  12. J. Akedo, Aerosol Deposition od Ceramic Thick Films at Room Temperature: Densification Mechanism of Ceramic Layers, J. Am. Ceram. Soc., 2006, 89(6), p 1834-1839

    Article  CAS  Google Scholar 

  13. J. Akedo, Room Temperature Impact Consolidation (RTIC) of Fine Ceramic Powder by Aerosol Deposition Method and Applications to Microdevices, J. Therm. Spray Technol., 2008, 17(2), p 181-198

    Article  CAS  Google Scholar 

  14. H. Park, J. Kwon, I. Lee, and C. Lee, Shock-Induced Plasticity and Fragmentation Phenomena during Alumina Deposition in the Vacuum Kinetic Spraying Process, Scr. Mater., 2015, 100, p 44-47

    Article  CAS  Google Scholar 

  15. H. Ashizawa and M. Kiyohara, Plasma Exposure Behavior of Yttrium Oxide Formed by Aerosol Deposition Method and Applications to Microdevices, IEEE Trans. Semicond. Manuf., 2017, 30(4), p 357-361

    Article  Google Scholar 

  16. H. Choi, K. Kim, H. Choi, S. Kang, J. Yun, Y. Shin, and T. Kim, Plasma Resistant Aluminum Oxide Coatings for Semiconductor Processing Apparatus by Atmospheric Spray Method, Surf. Coat. Tech., 2010, 205, p 125-128

    Article  Google Scholar 

  17. J.H. Jung, B.D. Hahn, W.H. Yoon, D.S. Park, J.J. Choi, J. Ryu, J.W. Kim, C. Ahn, and K.M. Song, Halogen Plasma Erosion Resistance of Rare Earth Oxide Films Deposited on Plasma Sprayed Alumina Coating by Aerosol Deposition, J. Eur. Ceram. Soc., 2012, 32(10), p 2451-2457

    Article  CAS  Google Scholar 

  18. D.M. Kim, Y.S. Oh, S. Kim, H.T. Kim, D.S. Lim, and S.M. Lee, The Erosion Behaviors of Y2O3 and YF3 Coatings under Fluorocarbon Plasma, Thin Solid Films, 2011, 519(20), p 6698-6702

    Article  CAS  Google Scholar 

  19. J. Exner, M. Schubert, D. Hanft, J. Kita, and R. Moos, How to Treat Powders for the Room Temperature Aerosol Deposition Method to Avoid Porous, Low Strength Ceramic Films, J. Eur. Ceram. Soc., 2019, 39(2), p 592-600

    Article  CAS  Google Scholar 

  20. A. Minshi, M.R. Foroughi, and M.R. Monshi, Modified Scherrer Equation to Estimate More Accurately Nano-Crystallite Size Using XRD, WJNES, 2012, 2(3), p 1154-1160

    Google Scholar 

  21. S. Sarker and V. Mahalingam, Tuning the Crystalline Phase and Morphology of the YF3: Eu3+ Microcrystals Through Fluoride Source, CrystEngComm, 2013, 15(29), p 5750-5755

    Article  Google Scholar 

  22. M.L. Meier, Measuring crystallite size using X-ray diffraction, the Williamson-Hall method, Department of Chemical Engineering and Materials Science, University of California, Oakland, 2005

    Google Scholar 

  23. J. Iwasawa, R. Nishimizu, M. Tokita, M. Kiyohara, and K. Uematsu, Plasma-Resistance Dense Yttrium Oxide Film Prepared by Aerosol Deposition Process, J. Am. Ceram. Soc., 2007, 90(8), p 2327-2332

    Article  CAS  Google Scholar 

  24. Y. Kasashima, N. Nabeoka, and F. Uesugi, Instantaneous Generation of Many Flaked Particles by Impulsive Force of Electric Field Stress Acting on Inner Wall of Mass-Production Plasma Etching Equipment, Jpn. J. Appl. Phys., 2013, 52(6R), p 066201

    Article  Google Scholar 

  25. H. Kwon, Y. Kim, H. Park, and C. Lee, The Importance of Intimate Inter-Crystallite Bonding for the Plasma Erosion Resistance of Vacuum Kinetic Sprayed Y2O3 Coating, Surf. Coat. Tech., 2019, 374, p 493-499

    Article  CAS  Google Scholar 

Download references

Acknowledgments

This work was supported by the World Class 300 Project R&D Support project (www.worldclass300.or.kr) funded by the Small and Medium Business Administration (SMBA, Korea) [Project Name: Development of Plasma-resistant Surface Treatment Technology for 3D-structure and Large-area Parts of Semiconductor/Display Fabrication Equipment].

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Correspondence to Changhee Lee.

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Kim, Y., Kwon, H., Park, H. et al. Correlation of Plasma Erosion Resistance and the Microstructure of YF3 Coatings Prepared by Vacuum Kinetic Spray. J Therm Spray Tech 29, 1016–1026 (2020). https://doi.org/10.1007/s11666-020-01019-4

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  • DOI: https://doi.org/10.1007/s11666-020-01019-4

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