Skip to main content
SpringerLink
Log in

Development of Al-25Si-xCe Alloy with High Conductivity and Low Expansivity for Thermal Management Purpose

  • Original Research Article
  • Published:
Journal of Materials Engineering and Performance Aims and scope Submit manuscript

Abstract

Nowadays, the power density of the precise integrated circuit is sharply increasing, improving the thermal conductivity of the electronic packaging materials is becoming more and more important. The aluminum alloys with high silicon content (such as Al-50Si) are becoming more and more popular in electronic packaging field due to their low cost and lightweight. But their thermal conductivities are needed to be promoted. In the present work, the cerium with different dosages (xCe = 5-20 wt.%) is introduced in to the Al hyper-eutectic alloy with 25 wt.% silicon. The addition of cerium is helpful to decrease the melting point of the Al-25Si alloy, which is favorable to save the processing cost. The thermal conductivity of this alloy is not lower than 100 W/(m K), which is close to the eutectic Al-Si alloy. From 25 to 200 °C, the coefficient of thermal expansion (CTE) of the Al-25Si-20Ce alloy is about 15-16 ppm/K. The relatively high thermal conductivity of the Al-25Si-xCe alloys is due to the addition of rare earth is favorable to the refinement of primary silicon phase. This study provides a design strategy toward the electronic packaging materials.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7

Similar content being viewed by others

References

  1. G. Chong, N. Li-Bin, M. Lan et al., Effects of Spark Plasma Sintering Parameters on Microstructure and Properties of Al-50 wt.% Si Alloys, Powder Metall. Met. Ceram., 2022, 60, p 556–566.

    Article  CAS  Google Scholar 

  2. J. Luo, R. Wang, C. Peng et al., Precipitation Behavior and Properties of Al-50Si-0.5X (X = Sc, La, Nb) Alloys, J. Mater. Sci. Mater. Electron., 2022, 33, p 7380–7395.

    Article  CAS  Google Scholar 

  3. Y. Jia, F. Cao, P. Ma et al., Microstructure and Thermal Conductivity of Hypereutectic Al-High Si Produced by Casting and Spray Deposition, J. Mater. Res., 2016, 31, p 2948–2955.

    Article  CAS  Google Scholar 

  4. X.Q. Wu, H. Yan, F.H. Chen et al., Effects of (Pr + Ce) Addition Treatments on Microstructure and Mechanical Properties of Al-5Si-12Cu Alloy, J. Mater. Eng. Perform., 2020, 29, p 1810–1819.

    Article  CAS  Google Scholar 

  5. W. Chen, Ya. Liu, H. Peng, J. Wang, and Su. Xuping, Effect of Strontium and Melt Purification on the Solidification Microstructure of Hypereutectic Al-Si Alloys, Mater. Today Commun., 2023, 34, 105310.

    Article  CAS  Google Scholar 

  6. Q. Li, J. Li, B. Li et al., Mechanical Properties and Microstructural Evolution of Yb-Modified Al-20%Si Alloy, J. Mater. Eng. Perform., 2018, 27, p 3498–3507.

    Article  CAS  Google Scholar 

  7. C. Zweben, Metal-Matrix Composites for Electronic Packaging, JOM, 1992, 44(7), p 15–23.

    Article  CAS  Google Scholar 

  8. Z. Qian, X. Liu, Z. Feng et al., High-Temperature Strengthening and Microstructure Analysis of Al-Si Multicomponent Piston Alloy by Micromixing RE, Cast, 2007, 56(2), p 141–144.

    CAS  Google Scholar 

  9. Z. Liu and Y.M. Hu, Effect of Yttrium on the Microstructure of a Semi-solid A356 Al Alloy, Rare Met., 2008, 27(5), p 536–540.

    Article  CAS  Google Scholar 

  10. J.K. Chen, H.Y. Hung, C.F. Wang et al., Effects of Casting and Heat Treatment Processes on the Thermal Conductivity of an Al-Si-Cu-Fe-Zn Alloy, Int. J. Heat Mass Transf., 2017, 105, p 189–195.

    Article  CAS  Google Scholar 

  11. K. Rao, J. Zhong, and Q. Fu, Effect of Rare Earth on Electrical and Thermal Conductivity of 6063 Aluminum Alloy, Aluminum Process., 2002, 06, p 22–24.

    Google Scholar 

  12. H. Duan, H. Zhang, G. Shao et al., Effect of Cerium on Microstructure and Properties of Hypereutectic Al-Si Alloys, Casting, 2005, 12, p 1265–1268.

    Google Scholar 

  13. D. Ting, Some Physicochemical Effects of Rare Earth Elements in Metallic Materials, J. Gold Sci., 1997, 01, p 69–77.

    Google Scholar 

  14. G. Zhong, Research on heat-resistant low expansion high silicon aluminum alloy and its ultrasonic semi-solid forming technology. Huazhong University of Science and Technology, (2011)

  15. Kitel, J. Xiang, and X. Wu, Introduction to Solid State Physics/Original, 8th ed. Chemical Industry Press, 2012.

    Google Scholar 

  16. V. Recoules and J.P. Crocombette, Ab Initio Determination of Electrical and Thermal Conductivity of Liquid Aluminum, Phys. Rev. B, 2005, 72, p 104202.

    Article  Google Scholar 

Download references

Acknowledgments

The authors acknowledge for the support by the Large Scientific Facility Open Subject of Songshan Lake, Dongguan, Guangdong (KFKT2022A10), Professional core curriculum construction “mold manufacturing process” (Dongguan Institute of Technology Teaching Research and Reform Project) (202002049), and Professional core curriculum construction “Stamping Process and Die Design” (Teaching Research and Reform Project of Dongguan Institute of Technology) (201902089).

Author information

Authors and Affiliations

  1. School of Mechanical Engineering, Dongguan University of Technology, Dongguan, 523808, Guangdong, China

    Xin Shang, Yongxing Li & Lingzhi Xie

  2. Institute of Science & Technology Innovation, Dongguan University of Technology, Building D2, Songshan Lake International Innovation and Entrepreneurship Community, Dongguan, Guangdong, China

    Zirong Zhou

  3. School of Materials Science and Engineering, Dongguan University of Technology, Dongguan, 523808, Guangdong, China

    Chengqian Zhong

  4. School of Vanadium Tianium, Panzhihua University, Panzhihua, 617000, China

    Lijuan Pang

  5. China Spallation Neutron Source, Dongguan, 523808, Guangdong, China

    Wen Yin

Authors
  1. Xin Shang
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Yongxing Li
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Zirong Zhou
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Chengqian Zhong
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Lingzhi Xie
    View author publications

    You can also search for this author in PubMed Google Scholar

  6. Lijuan Pang
    View author publications

    You can also search for this author in PubMed Google Scholar

  7. Wen Yin
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding authors

Correspondence to Xin Shang or Zirong Zhou.

Additional information

Publisher's Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Shang, X., Li, Y., Zhou, Z. et al. Development of Al-25Si-xCe Alloy with High Conductivity and Low Expansivity for Thermal Management Purpose. J. of Materi Eng and Perform (2024). https://doi.org/10.1007/s11665-024-09511-6

Download citation

  • Received:

  • Revised:

  • Accepted:

  • Published:

  • DOI: https://doi.org/10.1007/s11665-024-09511-6

Keywords

Search

Navigation