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Effect of Rolling Temperature and Annealing on Grain Refinement in TiNiCu Shape Memory Alloys

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Abstract

Grain size refinement is a highly desirable characteristic in TiNi-based shape memory alloys (SMA) because they prevent the loss of recoverable strain. The current study elucidates the role of rolling temperature on grain refinement in TiNiCu shape memory alloy. The control of deformation temperature, ranging from room temperature to cryogenic temperatures, allowed for control over the stored energy in the rolled samples. Observations revealed that the as-rolled samples stabilized the deformation-induced austenite phase below the martensite finish temperatures, effectively inhibiting the phase transformation. Consequently, this resulted in constant electrical resistivity values. However, subjecting the samples to heat treatment under similar conditions led to varying grain sizes, ranging from a few hundred nm to tens of microns. This subsequently restored the B2 → B19′ transformation. These findings signify the importance of rolling temperature on grain refinement in TiNiCu SMAs. Lower rolling temperature correlated with coarser grain size due to higher stored energy driving the early recrystallization and grain growth.

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Data Availability

The data used in the current study are part of an ongoing project and therefore could not be shared at the moment.

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Acknowledgments

The authors acknowledge the financial support of the Science and Engineering Research Board (SERB), India (Grant no. ECR/2016/000883). Characterization facilities available at the Department of Metallurgical and Materials Engineering (MMED) and the Institute Instrumentation Centre (IIC), IIT Roorkee, are also acknowledged.

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  1. Department of Metallurgical and Materials Engineering, Indian Institute of Technology Roorkee, Roorkee, Uttarakhand, 247 667, India

    Shashi Mohan Rao Varukuti, K. N. Chaithanya Kumar & K. S. Suresh

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Varukuti, S.M.R., Chaithanya Kumar, K.N. & Suresh, K.S. Effect of Rolling Temperature and Annealing on Grain Refinement in TiNiCu Shape Memory Alloys. J. of Materi Eng and Perform (2023). https://doi.org/10.1007/s11665-023-08825-1

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