Abstract
In this research work, commercially available pure copper was subjected to 85% rolling in both unidirectional (UDR) and multistep cross rolling (MSCR) methods to achieve ultra-fine grains (UFG). Following rolling, annealing was performed at temperatures ranging from 150 to 350 °C in 100 °C increments for 1 h. The mechanical characteristics and electrical conductivity of rolled copper were compared to as-received deformed copper after UDR and MSCR. A scanning electron microscope was used to examine the microstructure and texture of the samples (electron backscatter diffraction). Mechanical parameters were assessed using microtensile, microhardness, and formability tests (Erichsen cupping test), while electrical conductivity was determined using the four-point probe method. Yield strength and ultimate tensile strength for UDR specimens increased by 150 percent (120 MPa) and 114 percent (526 Mpa), respectively, whereas MSCR specimens increased by 312 percent (198 MPa) and 91 percent (471 MPa) when compared with the base specimen. An excellent combination of mechanical properties and electrical conductivity of about 86.68% IACS (International Annealed Copper Standard) and 88.43% IACS was obtained for both UDR and MSCR, respectively. MSCR specimen had a weaker texture with strong Bs orientation when compared with UDR rolled specimen. Change in strain path with each rolling pass resulted in continuous destabilization of the substrates that substantially weakened the texture.
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Pradeep Raja, C., Ramesh, T. Extensive Plastic Deformation to Improve the Mechanical Properties and Electrical Conductivity of Copper through Multistep Cross Rolling. J. of Materi Eng and Perform 32, 10514–10525 (2023). https://doi.org/10.1007/s11665-023-07873-x
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DOI: https://doi.org/10.1007/s11665-023-07873-x