Abstract
This paper focused on the quasi-static (strain rate of ~ 10−3 s−1) and dynamic compression (strain rate of ~ 102 s−1) behavior of closed-cell AlSi alloy foam at 25, 300, 420 and 560 °C. Quasi-static and dynamic stress–strain relations as well as deformation modes of the foam at different test temperatures were investigated. The results showed that as the test temperature increased, the compressive strength decreased both under quasi-static and dynamic loading. Compressive strength of the foam showed strong strain-rate sensitivity, exhibiting a maximum increase from 20.60 MPa at ~ 10−3 s−1 to 37.27 MPa at ~ 500 s−1 at 25 °C, from 2.99 MPa at ~ 10−3 s−1 to 10.49 MPa at ~ 500 s−1 at 560 °C. At similar strain rate of ~ 500 s−1 as an example, DIF (dynamic increase factor) showed a maximum increase from 1.81 at 25 °C to 3.50 at 560 °C, indicating that the strain-rate sensitivity of compressive strength increased with increase in temperature. Deformation modes of the foam under quasi-static compression revealed a variation from brittle to ductile as temperature increased, cell wall/edges showed brittle fracture at 25 and 300 °C and a combination of brittle fracture and plastic bending at 420 and 560 °C. The foam under dynamic compression showed evident wedge-shaped shear failure at all the temperatures tested.
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Acknowledgments
This project was supported by National Natural Science Foundation of China (Nos. 51874093, 51174060, 51661031), Science and Technology Department of Liaoning Province of China (Nos. 2013223004, 20170540304), Open Fund of State Key Laboratory of Silicate Materials for Architectures (Wuhan University of Technology) (No. SYSJJ2017-08) and the fundamental research funds for the central universities (N140203004, N170104023). The authors would like to acknowledge these organizations for financial support.
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Liang, X., Luo, H., Mu, Y. et al. Quasi-static and Dynamic Compression of Aluminum Foam at Different Temperatures. J. of Materi Eng and Perform 28, 4952–4963 (2019). https://doi.org/10.1007/s11665-019-04207-8
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DOI: https://doi.org/10.1007/s11665-019-04207-8