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Superplastic Forming/Diffusion Bonding Without Interlayer of 5A90 Al-Li Alloy Hollow Double-Layer Structure

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Abstract

The hollow double-layer structure of 5A90 Al-Li alloy was fabricated by SPF/DB process in this study. The characteristics and mechanism of 5A90 Al-Li alloy with respect to superplasticity and diffusion bonding were investigated. Tensile tests showed that the optimal elongation of tensile specimens was 243.97% at the temperature of 400 °C and the strain rate of 0.001 s−1. Effect of the surface roughness, bonding temperature and bonding time to determine the microstructure and mechanical properties of diffusion bonding joints was investigated, and the optimum bonding parameters were 540 °C/2.5 h/Ra18. Through the finite element simulation, it could be found that the SPF/DB process of hollow double-layer structure was feasible. The hollow double-layer structure of 5A90 Al-Li alloy was manufactured, showing that the thickness distribution of the bonding area was uniform and the thinnest part was the round corner. The SEM images of diffusion bonding joints showed that sound bonding interfaces were obtained in which no discontinuity existed.

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Acknowledgments

This work has been supported by the National Natural Science Foundation of China (No. 51305100), the National Science and Technology Major Project of China, the Project No. is 2014ZX04001-141.

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Authors and Affiliations

  1. National Key Laboratory of Precision Hot Processing of Metals, School of Materials Science and Engineering, Harbin Institute of Technology, Harbin, 150001, China

    Shaosong Jiang, Yong Jia, Zhen Lu, Chengcheng Shi & Kaifeng Zhang

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  1. Shaosong Jiang
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  2. Yong Jia
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  5. Kaifeng Zhang
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Correspondence to Yong Jia.

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Jiang, S., Jia, Y., Lu, Z. et al. Superplastic Forming/Diffusion Bonding Without Interlayer of 5A90 Al-Li Alloy Hollow Double-Layer Structure. J. of Materi Eng and Perform 26, 4265–4273 (2017). https://doi.org/10.1007/s11665-017-2912-3

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  • DOI: https://doi.org/10.1007/s11665-017-2912-3

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