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NiTiCu Shape Memory Alloy Characterization Through Microhardness Tests

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Abstract

NiTiCu alloys are one of the most investigated shape memory alloys (SMAs) because of their better performance as SMA actuators in a variety of industrial and engineering applications. However, NiTiCu alloys are strongly influenced by thermomechanical cycling (TMC), which causes degradation depending on the stress and strain level applied. Since heat treatment (HT) and TMC are essential for NiTiCu alloys, understanding how hardness evolves at different levels of TMC and different HT temperatures is a useful tool for characterizing the material. The aim of this paper is to investigate the relationship between hardness and different HT temperatures and different TMCs. All the microhardness tests were done below martensite finish temperature (Mf) because the apparent material hardness measured below Mf fairly reflects the relative strengthening of SMAs without involving martensitic transformation artifacts. Resistivity and break tensile tests were carried out as a first step in order to understand the effect of different HT temperatures. Microstructure was also examined to provide a basis for a mechanistic understanding of the effect of different HT temperatures. Next, the degradation of mechanical properties (functional fatigue) at different levels of TMC was evaluated to assess their relationship to the evolution of hardness. Finally, an attempt was made to establish a link between the increase in hardness and different HT temperatures with different levels of TMC.

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Correspondence to Albert Fabregat-Sanjuan.

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This article is an invited paper selected from presentations at the International Conference on Shape Memory and Superelastic Technologies 2013, held May 20-24, 2013, in Prague, Czech Republic, and has been expanded from the original presentation.

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Fabregat-Sanjuan, A., Ferrando, F. & De la Flor, S. NiTiCu Shape Memory Alloy Characterization Through Microhardness Tests. J. of Materi Eng and Perform 23, 2498–2504 (2014). https://doi.org/10.1007/s11665-014-1099-0

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  • DOI: https://doi.org/10.1007/s11665-014-1099-0

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